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Two-dimensional (2D) materials are uniquely suited for highly anisotropic thermal transport, which is important in thermoelectrics, thermal barrier coatings, and heat spreaders. Solution-processed 2D materials are attractive for simple, low-cost, and large-scale fabrication of devices on, virtually, any substrate. However, to date, there are only few reports with contrasting results on the thermal conductivity of graphene films, while thermal transport has been hardly measured for other types of solution-processed 2D material films. In this work, inkjet-printed graphene, h-BN and MoS2 films are demonstrated with thermal conductivities of â¼10 Wm-1K-1 and â¼0.3 Wm-1K-1 along and across the basal plane, respectively, giving rise to an anisotropy of â¼30, hardly dependent on the material type and annealing treatment. First-principles calculations indicate that portion of the phonon spectrum is cut-off by the quality of the thermal contact for transport along the plane, yet the ultra-low conductivity across the plane is associated with high-transmissivity interfaces. These findings can drive the design of highly anisotropic 2D material films for heat management applications.
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Gold sulfide monolayers (α-, ß-Au2S, α-, ß-, γ-AuS) have emerged as a new class of two-dimensional (2D) materials with appealing properties such as high thermal and dynamical stability, oxidation resistance, and excellent electron mobility. However, their thermal properties are still unexplored. In this study, based on first-principles calculations and the Peierls-Boltzmann transport equation, we report the lattice thermal conductivity (κ) and related phonon thermal properties of all members of this family. Our results show that gold sulfide monolayers have lattice thermal conductivity spanning almost three orders of magnitude, from 0.04 W m-1 K-1 to 10.62 W m-1 K-1, with different levels of anisotropy. Particularly, our results demonstrate that ß-Au2S with ultralow κ aa = 0.06 W m-1 K-1 and κ bb = 0.04 W m-1 K-1 along the principal in-plane directions, has one of the lowest κ values that have been reported for a 2D material, well below that of PbSe. This extremely low lattice thermal conductivity can be attributed to its flattened phonon branches and low phonon group velocity, high anharmonicity, and short phonon lifetimes. Our results may provide insight into the application of gold sulfide monolayers as thermoelectric materials, and motivate future κ measurements of gold sulfide monolayers.
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We systematically analyze the influence of 5 nm thick metal interlayers inserted at the interface of several sets of different metal-dielectric systems to determine the parameters that most influence interface transport. Our results show that despite the similar Debye temperatures of Al2O3and AlN substrates, the thermal boundary conductance measured for the Au/Al2O3system with Ni and Cr interlayers is â¼2× and >3× higher than the corresponding Au/AlN system, respectively. We also show that for crystalline SiO2(quartz) and Al2O3substrates having highly dissimilar Debye temperature, the measured thermal boundary conductance between Al/Al2O3and Al/SiO2are similar in the presence of Ni and Cr interlayers. We suggest that comparing the maximum phonon frequency of the acoustic branches is a better parameter than the Debye temperature to predict the change in the thermal boundary conductance. We show that the electron-phonon coupling of the metallic interlayers also alters the heat transport pathways in a metal-dielectric system in a nontrivial way. Typically, interlayers with large electron-phonon coupling strength can increase the thermal boundary conductance by dragging electrons and phonons into equilibrium quickly. However, our results show that a Ta interlayer, having a high electron-phonon coupling, shows a low thermal boundary conductance due to the poor phonon frequency overlap with the top Al layer. Our experimental work can be interpreted in the context of diffuse mismatch theory and can guide the selection of materials for thermal interface engineering.
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Some typographical errors were made in the original version of the manuscript associated with the value of the electron-phonon coupling constant for Ta, which are corrected here.
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Varying the thermal boundary conductance at metal-dielectric interfaces is of great importance for highly integrated electronic structures such as electronic, thermoelectric and plasmonic devices where heat dissipation is dominated by interfacial effects. In this paper we study the modification of the thermal boundary conductance at metal-dielectric interfaces by inserting metal interlayers of varying thickness below 10 nm. We show that the insertion of a tantalum interlayer at the Al/Si and Al/sapphire interfaces strongly hinders the phonon transmission across these boundaries, with a sharp transition and plateau within â¼1 nm. We show that the electron-phonon coupling has a major influence on the sharpness of the transition as the interlayer thickness is varied, and if the coupling is strong, the variation in thermal boundary conductance typically saturates within 2 nm. In contrast, the addition of a nickel interlayer at the Al/Si and the Al/sapphire interfaces produces a local minimum as the interlayer thickness increases, due to the similar phonon dispersion in Ni and Al. The weaker electron-phonon coupling in Ni causes the boundary conductance to saturate more slowly. Thermal property measurements were performed using time domain thermo-reflectance and are in good agreement with a formulation of the diffuse mismatch model based on real phonon dispersions that accounts for inelastic phonon scattering and phonon confinement within the interlayer. The analysis of the different assumptions included in the model reveals when inelastic processes should be considered. A hybrid model that introduces inelastic scattering only when the materials are more acoustically matched is found to better predict the thickness dependence of the thermal boundary conductance without any fitting parameters.
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In this work, we present the implementation of a new method to perform high-frequency thermoreflectance measurements on thin films. The so-called differential broad-band frequency domain thermoreflectance method follows broad-band frequency domain thermoreflectance developed previously [Regner et al., Rev. Sci. Instrum. 84(6), 064901 (2013)], without the use of expensive electro-optic modulators. Two techniques are introduced to recover the thermal phase of interest and to separate it from the unwanted instrumental contributions to the recorded phase. Measuring a differential thermal phase by either varying the spot size or offsetting the pump and probe beams, the thermophysical properties of materials can be extracted. This approach enables the study of nanoscale heat transport where non-equilibrium phenomena are dominating.
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The detection of magnetic fields with nanoscale resolution is a fundamental challenge for scanning probe magnetometry, biosensing, and magnetic storage. Current technologies based on giant magnetoresistance and tunneling magnetoresistance are limited at small sizes by thermal magnetic noise and spin-torque instability. These limitations do not affect Hall sensors consisting of high mobility semiconductors or metal thin films, but the loss of magnetic flux throughout the sensor's thickness greatly limits spatial resolution and sensitivity. Here we demonstrate graphene extraordinary magnetoresistance devices that combine the Hall effect and enhanced geometric magnetoresistance, yielding sensitivities rivaling that of state of the art sensors but do so with subnanometer sense layer thickness at the sensor surface. Back-gating provides the ability to control sensor characteristics, which can mitigate both inherent variations in material properties and fabrication-induced device-to-device variability that is unavoidable at the nanoscale.
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Técnicas Biossensoriais/instrumentação , Carbono/química , Magnetismo/instrumentação , Nanotecnologia/instrumentação , Nanotecnologia/métodos , Eletrônica , Desenho de Equipamento , Manufaturas , Teste de Materiais , Microscopia de Força Atômica , Nanoestruturas , Pressão , Semicondutores , Temperatura , TransdutoresRESUMO
We demonstrate n- and p-type field-effect transistors based on Si nanowires (SiNWs) implanted with P and B at fluences as high as 10(15) cm (-2). Contrary to what would happen in bulk Si for similar fluences, in SiNWs this only induces a limited amount of amorphization and structural disorder, as shown by electrical transport and Raman measurements. We demonstrate that a fully crystalline structure can be recovered by thermal annealing at 800 degrees C. For not-annealed, as-implanted NWs, we correlate the onset of amorphization with an increase of phonon confinement in the NW core. This is ion-dependent and detectable for P-implantation only. Hysteresis is observed following both P and B implantation.
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Nanowire lithography (NWL) uses nanowires (NWs), grown and assembled by chemical methods, as etch masks to transfer their one-dimensional morphology to an underlying substrate. Here, we show that SiO2 NWs are a simple and compatible system to implement NWL on crystalline silicon and fabricate a wide range of architectures and devices. Planar field-effect transistors made of a single SOI-NW channel exhibit a contact resistance below 20 kOmega and scale with the channel width. Further, we assess the electrical response of NW networks obtained using a mask of SiO2 NWs ink-jetted from solution. The resulting conformal network etched into the underlying wafer is monolithic, with single-crystalline bulk junctions; thus no difference in conductivity is seen between a direct NW bridge and a percolating network. We also extend the potential of NWL into the third dimension, by using a periodic undercutting that produces an array of vertically stacked NWs from a single NW mask.
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Cristalização/métodos , Nanoestruturas/química , Nanoestruturas/ultraestrutura , Nanotecnologia/instrumentação , Dióxido de Silício/química , Transistores Eletrônicos , Desenho de Equipamento , Análise de Falha de Equipamento , Teste de Materiais , Miniaturização , Conformação Molecular , Nanotecnologia/métodos , Tamanho da PartículaRESUMO
We present atomic-scale, video-rate environmental transmission electron microscopy and in situ time-resolved X-ray photoelectron spectroscopy of surface-bound catalytic chemical vapor deposition of single-walled carbon nanotubes and nanofibers. We observe that transition metal catalyst nanoparticles on SiOx support show crystalline lattice fringe contrast and high deformability before and during nanotube formation. A single-walled carbon nanotube nucleates by lift-off of a carbon cap. Cap stabilization and nanotube growth involve the dynamic reshaping of the catalyst nanocrystal itself. For a carbon nanofiber, the graphene layer stacking is determined by the successive elongation and contraction of the catalyst nanoparticle at its tip.
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The adiabatic Born-Oppenheimer approximation (ABO) has been the standard ansatz to describe the interaction between electrons and nuclei since the early days of quantum mechanics. ABO assumes that the lighter electrons adjust adiabatically to the motion of the heavier nuclei, remaining at any time in their instantaneous ground state. ABO is well justified when the energy gap between ground and excited electronic states is larger than the energy scale of the nuclear motion. In metals, the gap is zero and phenomena beyond ABO (such as phonon-mediated superconductivity or phonon-induced renormalization of the electronic properties) occur. The use of ABO to describe lattice motion in metals is, therefore, questionable. In spite of this, ABO has proved effective for the accurate determination of chemical reactions, molecular dynamics and phonon frequencies in a wide range of metallic systems. Here, we show that ABO fails in graphene. Graphene, recently discovered in the free state, is a zero-bandgap semiconductor that becomes a metal if the Fermi energy is tuned applying a gate voltage, Vg. This induces a stiffening of the Raman G peak that cannot be described within ABO.
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We report surface-bound growth of single-wall carbon nanotubes (SWNTs) at temperatures as low as 350 degrees C by catalytic chemical vapor deposition from undiluted C2H2. NH3 or H2 exposure critically facilitates the nanostructuring and activation of sub-nanometer Fe and Al/Fe/Al multilayer catalyst films prior to growth, enabling the SWNT nucleation at lower temperatures. We suggest that carbon nanotube growth is governed by the catalyst surface without the necessity of catalyst liquefaction.