Evaluation of end-of-life vehicle recycling system in India in responding to the sustainability paradigm: an explorative study.

The growing number of end-of-life vehicles (ELVs) engenders a genuine concern for achieving sustainable development. Properly recycling ELV is paramount to checking pollution, reducing landfills, and conserving natural resources. The present study evaluates the sustainability of India's ELV recycling system from techno-socio-economic and environmental aspects as an instrumental step for assessing performance and progress. This investigation has performed the Strength-Weakness-Opportunity-Threat (SWOT) analysis to evaluate ELV recycling in the long-term viability and examine the critical factors and potential. This research makes practical recommendations for effectively encountering persistent challenges in the ELV recycling system based on Indian values. This research adopts an explorative and Integrated bottom-up mixed approach; it interfaces qualitative and quantitative data and secondary research. This study reveals that the social, economic, technological, and environmental aspects of the sustainability of India's ELV recycling system are comparatively limited. The SWOT analysis demonstrates that potential market size and resource recovery are more significant strengths, whereas lack of an appropriate framework and limited technology are major challenges in the recycling of ELVs in India. Sustainable development and economic viability have emerged as great opportunities, while informality and environmental impact have surfaced as primary potential threats to ELV recycling in India. This paper offers insights and yields critical real-world data that may assist in rational decision-making and developing and implementing any subsequent framework.

Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components.

The significant increase in metal costs has forced the electronics industry to provide new materials and methods to reduce costs, while maintaining customers' high-quality expectations. This paper considers the problem of most electronic industries in reducing costly materials, by introducing a solder paste with alloy composition tin 98.3%, silver 0.3%, and copper 0.7%, used for the construction of the surface mount fine-pitch component on a Printing Wiring Board (PWB). The reliability of the solder joint between electronic components and PWB is evaluated through the dynamic characteristic test, thermal shock test, and Taguchi method after the printing process. After experimenting with the dynamic characteristic test and thermal shock test with 20 boards, the solder paste was still able to provide a high-quality solder joint. In particular, the Taguchi method is used to determine the optimal control parameters and noise factors of the Solder Printer (SP) machine, that affects solder volume and solder height. The control parameters include table separation distance, squeegee speed, squeegee pressure, and table speed of the SP machine. The result shows that the most significant parameter for the solder volume is squeegee pressure (2.0 mm), and the solder height is the table speed of the SP machine (2.5 mm/s).