Heteroatom substitution enhances generation and reactivity of surface-activated peroxydisulfate complexes for catalytic fenton-like reactions.

Peroxydisulfate (PDS)-based Fenton-like reactions are promising advanced oxidation processes (AOPs) to degrade recalcitrant organic water pollutants. Current research predominantly focuses on augmenting the generation of reactive species (e.g., surface-activated PDS complexes (PDS*) to improve treatment efficiency, but overlooks the potential benefits of enhancing the reactivity of these species. Here, we enhanced PDS* generation and reactivity by incorporating Zn into CuO catalyst lattice, which resulted in 99% degradation of 4-chlorophenol within only 10 min. Zn increased PDS* generation by nearly doubling PDS adsorption while maintaining similar PDS to PDS* conversion efficiency, and induced higher PDS* reactivity than the common catalyst CuO, as indicated by a 4.1-fold larger slope between adsorbed PDS and open circuit potential of a catalytic electrode. Cu-O-Zn formation upshifts the d-band center of Cu sites and lowers the energy barrier for PDS adsorption and sulfate desorption, resulting in enhanced PDS* generation and reactivity. Overall, this study informs strategies to enhance PDS* reactivity and design highly active catalysts for efficient AOPs.

Reactions of graphene supported Co3O4 nanocubes with lithium and magnesium studied by in situ transmission electron microscopy.

Reaction beyond intercalation and the utilization of metal ions beyond lithium-ions are two promising approaches for developing the next generation of high capacity and low cost energy storage materials. Here, we use graphene supported Co3O4 nanocubes and study their reaction with lithium, magnesium and aluminum using in situ transmission electron microscopy. On lithiation, the Co3O4 nanocubes decompose to Co metal nanoparticles (2 to 3 nm) and embed in as-formed Li2O matrix; conversely, the CoO nanoparticles form on the Co site accompanying the decomposition of Li2O in the delithiation process. The lithiation process is dominated by surface diffusion of Li(+), and graphene sheets enhance the Li(+) diffusion. However, upon charge with magnesium, the Mg(2+) diffusion is sluggish, and there is no sign of conversion reaction between Mg and Co3O4 at room temperature. Instead, a thin film consisting of metal Mg nanoparticles is formed on the surface of graphene due to a process similar to metal plating. The Al(3+) diffusion is even more sluggish and no reaction between Al and Co3O4 is observed. These findings provide insights to tackle the reaction mechanism of multivalent ions with electrode materials.

Effects of particle size of fiberglass-resin powder from PCBs on the properties and volatile behavior of phenolic molding compound.

Fiberglass-resin powder (FR powder), a mixture of resin powder and glass fibers reclaimed from pulverized waste printed circuit boards (PCBs), is used as a partial substitute of wood flour in the production of modified phenolic molding compound (MPMC). The results show that incorporation of FR powder into MPMC as a filler enhances the thermal stability represented by heat deflection temperature (HDT). MPMC with FR powder smaller than 0.07 mm shows better properties, with a flexural strength of 73 MPa, a charpy notched impact strength of 3.0 kJ/m(2), a HDT of 167 degrees C, and a dielectric strength of 3.7 MV/m, all of which meet the standard data. Thermogravimetric analysis shows that thermal degradation of MPMC mainly includes three steps, and over 55% weight loss of MPMC occurs between temperatures of 370 degrees C and 575 degrees C. Phenol is the main volatile compound released from molding powder during the production of molding product. After molding powder cures to molding product, low level of residual phenol is detected. All the results indicate that the MPMC can be used as a new type of molding compound.

Phenolic molding compound filled with nonmetals of waste PCBs.

Nonmetals reclaimed from waste phenolic cellulose paper printed circuit boards (PCBs) are used to replace wood flour in the production of phenolic molding compound (PMC). The results indicate that filling of nonmetals in PMC improves the charpy notched impact strength and heat deflection temperature (HDT) and reduces flexural strength and rasching fluidity. Rasching fluidity decreases dramatically with the increase of the content of nonmetals. To ensure sufficient properties of PMC, the optimal added content of nonmetals is 20 wt %, which results in a flexural strength of 70 MPa, a charpy notched impact strength of 2.4 KJ/m2, a HDT of 168 degrees C, a dielectric strength of 3.9 MV/m, and a rasching fluidity of 103 mm, all of which meet the national standard data. When the added content of nonmetals is 20%, the charpy notched impact strength, HDT, and rasching fluidity of PMC decrease, and the flexural and dielectric strengths decrease at first and then increase with decreasing particle sizes. All the results indicate that making PMC with nonmetals of waste PCBs can resolve environmental pollution, reuse nonmetals in different fields, and provide a new method for resource utilization of nonmetals from waste PCBs.

Application of glass-nonmetals of waste printed circuit boards to produce phenolic moulding compound.

The aim of this study was to investigate the feasibility of using glass-nonmetals, a byproduct of recycling waste printed circuit boards (PCBs), to replace wood flour in production of phenolic moulding compound (PMC). Glass-nonmetals were attained by two-step crushing and corona electrostatic separating processes. Glass-nonmetals with particle size shorter than 0.07 mm were in the form of single fibers and resin powder, with the biggest portion (up to 34.6 wt%). Properties of PMC with glass-nonmetals (PMCGN) were compared with reference PMC and the national standard of PMC (PF2C3). When the adding content of glass-nonmetals was 40 wt%, PMCGN exhibited flexural strength of 82 MPa, notched impact strength of 2.4 kJ/m(2), heat deflection temperature of 175 degrees C, and dielectric strength of 4.8 MV/m, all of which met the national standard. Scanning electron microscopy (SEM) showed strong interfacial bonding between glass fibers and the phenolic resin. All the results showed that the use of glass-nonmetals as filler in PMC represented a promising method for resolving the environmental pollutions and reducing the cost of PMC, thus attaining both environmental and economic benefits.