Wetting state and mechanical property alteration for the Fe3Si films using rapid thermal annealing under various temperatures.

The current research demonstrates the modification of the wetting behavior and mechanical features as well as structure and morphology of Fe3Si films created via facing target sputtering by the rapid thermal annealing (RTA) with the set RTA temperatures (TRTA) of 200, 400, 600, and 800 °C. Following the RTA process, the crystallinity of Fe3Si developed under 400 °C or below. At the 600 °C and 800 °C TRTA, new crystal orientations emerged for FeSi and then ß-FeSi2, respectively. Together with composition results, the Fe3Si films were proven to change into FeSi and then FeSi2 under a high TRTA regime. At temperatures of 600 °C and 800 °C, large crystallites, including the scraggly interface, were observed. The root-mean-square roughness roughened slightly according to the RTA process at TRTA of 600 °C or above. The hydrophobic properties of the Fe3Si film surfaces became hydrophilic after the RTA procedure at a TRTA value above 400 °C. The hardness value of the Fe3Si films evidently increased through RTA at 600 °C and 800 °C. Thus, above 400 °C, the RTA process significantly alters the physical features of as-created Fe3Si films.

The Role of Zn Substitution in Improving the Electrical Properties of CuI Thin Films and Optoelectronic Performance of CuI MSM Photodetectors.

Pure CuI and Zn-substituted CuI (CuI:Zn) semiconductor thin films, and metal-semiconductor-metal (MSM) photodetectors were fabricated on glass substrates by a low-temperature solution process. The influence of Zn substitution concentration (0-12 at%) on the microstructural, optical, and electrical characteristics of CuI thin films and its role in improving the optoelectronic performance of CuI MSM photodetectors were investigated in this study. Incorporation of Zn cation dopant into CuI thin films improved the crystallinity and increased the average crystalline size. XPS analysis revealed that the oxidation state of Cu ions in all the CuI-based thin films was +1, and the estimated values of [Cu]/[I] for the CuI:Zn thin films were lower than 0.9. It was found that the native p-type conductivity of polycrystalline CuI thin film was converted to n-type conductivity after the incorporation of Zn ions into CuI nanocrystals, and the electrical resistivity decreased with increases in Zn concentration. A time-resolved photocurrent study indicated that the improvements in the optoelectronic performance of CuI MSM photodetectors were obtained through the substitution of Zn ions, which provided operational stability to the two-terminal optoelectronic device. The 8 at% Zn-substituted CuI photodetectors exhibited the highest response current, responsivity, and EQE, as well as moderate specific detectivity.

Diode Parameters and Equivalent Electrical Circuit Model of n-Type Silicon/B-Doped p-Type Ultrananocrystalline Diamond Heterojunctions Manufactured Through Coaxial Arc Plasma Deposition.

Coaxial arc plasma deposition (CAPD) was employed to manufacture n-type silicon/boron-doped p-type ultrananocrystalline diamond heterojunctions. Measurement and analysis of their dark current density-voltage curve were carried out at room temperature in order to calculate the requisite junction parameters using the Cheung and Norde approaches. For the calculation based on the Cheung approach, the series resistance (Rs), ideality factor (n) and barrier height (Φb) were 4.58 kΩ, 2.82 and 0.75 eV, respectively. The values of Rs and Φb were in agreement with those calculated using the Norde approach. Their characteristics for alternative current impedance at different frequency values were measured and analyzed as a function of the voltage (V) values ranging from 0 V to 0.5 V. Appearance of the real (Z') and imaginary (Z″) characteristics for all V values presented single semicircles. The centers of the semicircular curves were below the Z' axis and the diameter of the semicircles decreased with increments of the V value. The proper equivalent electrical circuit model for the manufactured heterojunction behavior was comprised of Rs combined with the parallel circuit of resistance and constant phase element.

Photovoltaic Properties and Series Resistance of p-Type Si/Intrinsic Si/n-Type Nanocrystalline FeSi2 Heterojunctions Created by Utilizing Facing-Targets Direct-Current Sputtering.

p-Type Si/intrinsic Si/n-type nanocrystalline iron disilicide heterojunctions were created by utilizing facing targets direct-current sputtering at the pressure of 1.33×10-1 Pa that investigated the photovoltaic properties. They exhibited a large leakage current and a small energy conversion efficiency of 0.62%. From using the method of Nicollian and Brews, the series resistance (Rs) values at zero bias voltage were 7.40 Ω at 2 MHz and 7.57 Ω at 50 kHz, respectively, which were in agreement with that estimated by the means of Norde. From applying the method of Hill-Coleman, the interface state density (nss) values were 3.15×1015 cm-2 eV-1 at 50 kHz and 8.93×1013 cm-2 eV-1 at 2 MHz. The obtained results revealed the presence of Rs and nss at the junction interface, which should be the potential cause of spoiled photovoltaic performance in the heterojunctions.

Interface State Density and Series Resistance of n-Type Nanocrystalline FeSi2/p-Type Si Heterojunctions Formed by Utilizing Facing-Target Direct-Current Sputtering.

n-Type nanocrystalline FeSi2/p-type Si heterojunctions were formed by using facing-target direct- current sputtering at room temperature. The J-V characteristic results revealed that the reverse leakage current is large and the response under illumination of near-infrared light is very weak. The capacitance-voltage-frequency (C-V-f) and conductance-voltage-frequency (G-V-f) measurements were carried out at room temperature in order to estimate the series resistance (Rs) by using the Nicollian-Brews method and the density of interface state (Nss) by using the Hill-Coleman method. By estimation according to the Nicollian-Brews method, the Rs value increases with decreasing f value. The Rs values at zero bias voltage were 2.07 Ω at 60 kHz and 1.54 Ω at 2 MHz, which are consistent with those calculated by using the Cheung's and Norde's methods. The obtained Rs should be attributable to the Rs existing in the ohmic contact and neutral regions, which is the current-limiting factor for junctions. The nss values calculated by using the Hill-Coleman method were 2.70 × 1014 eV-1cm-2 at 60 kHz and 1.43 × 1013 eV-1cm-2 at 2 MHz. This result revealed the presence of interface states at the hetero-interface behaving as a leakage current center and a trap center of the photo-generated carrier, which degraded the junction properties at room temperature.