Progress in the Optimization of Compositional Design and Thermomechanical Processing of Metastable ß Ti Alloys for Biomedical Applications.

Over the past few years, significant research and development in the manufacturing industry related to the medical field has been done. The aim has been to improve existing biomaterials and bioimplants by exploring new methods and strategies. Beta titanium alloys, known for their exceptional strength-to-modulus ratio, corrosion resistance, biocompatibility, and ease of shaping, are expected to play a crucial role in manufacturing the next generation of biomedical equipment. To meet the specific requirements of human bone, researchers have employed key techniques like compositional design and thermomechanical processing routes to advance biomaterial development. These materials find extensive applications in orthopedic, orthodontic, and cardiovascular biomedical implants. Several studies have shown that precise material composition, with appropriate heat treatment and suitable mechanical approaches, can yield the desired mechanical properties for bone implants. In this review article, we explore the evolution of alloys at different stages, with a particular focus on their preparation for use in biomedical implants. The primary focus is on designing low-modulus ß Ti alloy compositions and employing processing techniques to achieve high strength while maintaining a low young modulus suitable for biomedical applications.

Role of inter-nanowire distance in metal nanowires on pool boiling heat transfer characteristics.

Energy management in data centres is crucial where a maximum portion of energy is spent on thermal management and electronics cooling systems. It becomes very crucial when it comes to immersion cooling techniques (pool boiling mechanism) using dielectric fluids. Role of metal nanowires (Cu and Ag) with different inter-nanowire distance values were analysed for their pool boiling performance. Templates with different inter-pore distances (260 ±â€¯20 nm, 320 ±â€¯20 nm and 360 ±â€¯20 nm) and diameter of 200 nm were used to deposit copper nanowires (CuNW) and silver nanowires (AgNW) over the copper substrate using electrodeposition technique. Electrodeposition conditions like voltage and time were optimised to obtain nanowires of near constant height and different surface density coverage. To investigate the role of these metal nanowires on pool boiling characteristics, a dedicated pool boiling experimental facility was fabricated and experiments were carried out using FC-72 as working fluid. As a result of experimental investigation, boiling incipience superheat was observed to reduce which is very important for electronics systems. Also, both the critical heat flux (CHF) and heat transfer coefficient (h) were found to be increased as compared to the bare copper surface. Increasing the distance between nanowires, decreases the number of nanowires per unit area and thus the surface density coverage. This increases the cavity density and cavity size of micron-scale cavities in favour of pool boiling enhancement. This also decreases the resistance to fluid flow at high heat flux values which delays the surface dryout and critical heat flux.