Flexible Quantum-Dot Color-Conversion Layer Based on Microfluidics for Full-Color Micro-LEDs.

In this article, red and green perovskite quantum dots are incorporated into the pixels of a flexible color-conversion layer assembly using microfluidics. The flexible color-conversion layer is then integrated with a blue micro-LED to realize a full-color display with a pixel pitch of 200 µm. Perovskite quantum dots feature a high quantum yield, a tunable wavelength, and high stability. The flexible color-conversion layer using perovskite quantum dots shows good luminous and display performance under different bending conditions; is easy to manufacture, economical, and applicable; and has important potential applications in the development of flexible micro-displays.

2000 PPI silicon-based AlGaInP red micro-LED arrays fabricated via wafer bonding and epilayer lift-off.

In this article, 2000 PPI red silicon-based AlGaInP micro-LED arrays were fabricated and investigated. The AlGaInP epilayer was transferred onto the silicon substrate via the In-Ag bonding technique and an epilayer lift-off process. The silicon substrate with a high thermal conductivity could provide satisfactory heat dissipation, leading to micro-LED arrays that had a stable emission spectrum with increasing current density from 20 to 420 A/cm2 along with a red-shift of the peak position from 624.69 to 627.12 nm (Δλ = 2.43 nm). Additionally, increasing the injection current density had little effect on the CIE (x, y) of the micro-LED arrays. Further, the I-V characteristics and light output power of micro-LED arrays with different pixel sizes demonstrated that the AlGaInP red micro-LED array on a silicon substrate had excellent electrical stability and optical output.

48 × 48 pixelated addressable full-color micro display based on flip-chip micro LEDs.

This paper reports on the design and fabrication of a ${48} \times {48}$48×48 full-color pixelated addressable light-emitting diode on silicon (LEDoS) micro display. The metallization pattern was designed and fabricated on a silicon substrate, while red, green, and blue monochromatic micro LEDs were integrated on the silicon substrate using transfer printing. The red, green, and blue micro LEDs are flip-chip structures in which red micro LEDs were fabricated using substrate transfer, mesa etching, metal deposition, and chip dicing. The integration process does not require wire bonding, which reduces the full-color pixel size and increases the integration speed. The LEDoS micro display can be addressed individually for each LED pixel and display representative patterns.