RESUMO
Tissue elasticity remains an essential biomarker of health and is indicative of irregularities such as tumors or infection. The timely detection of such abnormalities is crucial for the prevention of disease progression and complications that arise from late-stage illnesses. However, at both the bedside and the operating table, there is a distinct lack of tactile feedback for deep-seated tissue. As surgical techniques advance toward remote or minimally invasive options to reduce infection risk and hasten healing time, surgeons lose the ability to manually palpate tissue. Furthermore, palpation of deep structures results in decreased accuracy, with the additional barrier of needing years of experience for adequate confidence of diagnoses. This review delves into the current modalities used to fulfill the clinical need of quantifying physical touch. It covers research efforts involving tactile sensing for remote or minimally invasive surgeries, as well as the potential of ultrasound elastography to further this field with non-invasive real-time imaging of the organ's biomechanical properties. Elastography monitors tissue response to acoustic or mechanical energy and reconstructs an image representative of the elastic profile in the region of interest. This intuitive visualization of tissue elasticity surpasses the tactile information provided by sensors currently used to augment or supplement manual palpation. Focusing on common ultrasound elastography modalities, we evaluate various sensing mechanisms used for measuring tactile information and describe their emerging use in clinical settings where palpation is insufficient or restricted. With the ongoing advancements in ultrasound technology, particularly the emergence of micromachined ultrasound transducers, these devices hold great potential in facilitating early detection of tissue abnormalities and providing an objective measure of patient health.
RESUMO
The trade-off between the functionalization shift of the informative parameters and sensitivity of capacitive micromachined ultrasound transducers (CMUT)-based CO2 sensors is addressed, and the CMUT surface modification process by thin inkjet-printed polyethyleneimine (PEI) films is optimized. It was shown that by the proper preparation of the active CMUT surface and properly diluted PEI solution, it is possible to minimize the functionalization shift of the resonance frequency and the quality of the resonance and preserve the sensitivity potential. So, after optimization, we demonstrated 23.2 kHz frequency shift readings of the sensor with 16 MHz nominal frequency while in the gas chamber and switching between pure N2 and CO2. After testing the sensors with different PEI film thickness, it was confirmed that a 200 nm average thickness of a PEI film is an optimum, because this is the practical limit of CO2 absorption depth at given conditions. Additionally, we note that modification of the hydrophilic/hydrophobic properties of the CMUT surface allows changing the nanoscale surface roughness of the printed PEI film and controlling the area resolution of the inkjet functionalization by reducing the diameter of a single dot down to 150 µm by a commercially available printer cartridge.
RESUMO
Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive manufacturing (AM) for RDL formation seems to be an auspicious approach, as those challenges are conquered by principle. In this study, by exploiting the benefits of AM, RDLs for fan-out packaging of capacitive micromachined ultrasound transducers (CMUT) were realized via drop-on-demand inkjet printing technology. The long-term reliability of the printed tracks was assessed via temperature cycling tests. The effects of multilayering and implementation of an insulating ramp on the reliability of the conductive tracks were identified. Packaging-induced stresses on CMUT dies were further investigated via laser-Doppler velocimetry (LDV) measurements and the corresponding resonance frequency shift. Conclusively, the bottlenecks of the inkjet-printed RDLs for FOWLP were discussed in detail.