Investigation of thermal effects in through-silicon vias using scanning thermal microscopy.

Wielgoszewski, Grzegorz; Józwiak, Grzegorz; Babij, Michal; Baraniecki, Tomasz; Geer, Robert; Gotszalk, Teodor.

Afiliação

Wielgoszewski G; Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, ul. Z. Janiszewskiego 11/17, PL-50372 Wroclaw, Poland. Electronic address: Grzegorz.Wielgoszewski@pwr.edu.pl.
Józwiak G; Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, ul. Z. Janiszewskiego 11/17, PL-50372 Wroclaw, Poland.
Babij M; Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, ul. Z. Janiszewskiego 11/17, PL-50372 Wroclaw, Poland.
Baraniecki T; Wroclaw University of Technology, Faculty of Mechanical Engineering, ul. I. Lukasiewicza 5, PL-50371 Wroclaw, Poland.
Geer R; University at Albany, College of Nanoscale Science and Engineering, 257 Fuller Road, Albany, NY 12203, USA.
Gotszalk T; Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, ul. Z. Janiszewskiego 11/17, PL-50372 Wroclaw, Poland.

Micron ; 66: 63-8, 2014 Nov.

Article em En | MEDLINE | ID: mdl-25080278