Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding.

Tseng, Chih-Han; Tu, K N; Chen, Chih.

Afiliação

Tseng CH; Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan, 30010, Republic of China.
Tu KN; International College of Semiconductor Technology, National Chiao Tung University, Hsinchu, Taiwan, 30010, Republic of China.
Chen C; Department of Materials Science and Engineering, UCLA, Los Angeles, CA, USA.

Sci Rep ; 8(1): 10671, 2018 Jul 13.

Article em En | MEDLINE | ID: mdl-30006591

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2018 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2018 Tipo de documento: Article