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Mechanically transformative electronics, sensors, and implantable devices.
Byun, Sang-Hyuk; Sim, Joo Yong; Zhou, Zhanan; Lee, Juhyun; Qazi, Raza; Walicki, Marie C; Parker, Kyle E; Haney, Matthew P; Choi, Su Hwan; Shon, Ahnsei; Gereau, Graydon B; Bilbily, John; Li, Shuo; Liu, Yuhao; Yeo, Woon-Hong; McCall, Jordan G; Xiao, Jianliang; Jeong, Jae-Woong.
Afiliação
  • Byun SH; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Sim JY; Welfare & Medical ICT Research Department, Electronics and Telecommunications Research Institute, Daejeon 34129, Republic of Korea.
  • Zhou Z; Department of Mechanical Engineering, University of Colorado Boulder, Boulder, CO 80309, USA.
  • Lee J; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Qazi R; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Walicki MC; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA.
  • Parker KE; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.
  • Haney MP; Department of Pharmaceutical and Administrative Sciences, St. Louis College of Pharmacy, St. Louis, MO 63110, USA.
  • Choi SH; Center for Clinical Pharmacology, St. Louis College of Pharmacy and Washington University School of Medicine, St. Louis, MO 63110, USA.
  • Shon A; Washington University Pain Center, Washington University in St. Louis, St. Louis, MO 63110, USA.
  • Gereau GB; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.
  • Bilbily J; Department of Pharmaceutical and Administrative Sciences, St. Louis College of Pharmacy, St. Louis, MO 63110, USA.
  • Li S; Center for Clinical Pharmacology, St. Louis College of Pharmacy and Washington University School of Medicine, St. Louis, MO 63110, USA.
  • Liu Y; Washington University Pain Center, Washington University in St. Louis, St. Louis, MO 63110, USA.
  • Yeo WH; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA.
  • McCall JG; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea.
  • Xiao J; Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO 80309, USA.
  • Jeong JW; Department of Anesthesiology, Washington University in St. Louis, St. Louis, MO 63110, USA.
Sci Adv ; 5(11): eaay0418, 2019 11.
Article em En | MEDLINE | ID: mdl-31701008
ABSTRACT
Traditionally, electronics have been designed with static form factors to serve designated purposes. This approach has been an optimal direction for maintaining the overall device performance and reliability for targeted applications. However, electronics capable of changing their shape, flexibility, and stretchability will enable versatile and accommodating systems for more diverse applications. Here, we report design concepts, materials, physics, and manufacturing strategies that enable these reconfigurable electronic systems based on temperature-triggered tuning of mechanical characteristics of device platforms. We applied this technology to create personal electronics with variable stiffness and stretchability, a pressure sensor with tunable bandwidth and sensitivity, and a neural probe that softens upon integration with brain tissue. Together, these types of transformative electronics will substantially broaden the use of electronics for wearable and implantable applications.
Assuntos

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Técnicas Biossensoriais / Eletrônica / Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2019 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Técnicas Biossensoriais / Eletrônica / Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2019 Tipo de documento: Article