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Strong optical response and light emission from a monolayer molecular crystal.
Zhao, Huijuan; Zhao, Yingbo; Song, Yinxuan; Zhou, Ming; Lv, Wei; Tao, Liu; Feng, Yuzhang; Song, Biying; Ma, Yue; Zhang, Junqing; Xiao, Jun; Wang, Ying; Lien, Der-Hsien; Amani, Matin; Kim, Hyungjin; Chen, Xiaoqing; Wu, Zhangting; Ni, Zhenhua; Wang, Peng; Shi, Yi; Ma, Haibo; Zhang, Xiang; Xu, Jian-Bin; Troisi, Alessandro; Javey, Ali; Wang, Xinran.
Afiliação
  • Zhao H; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Zhao Y; Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.
  • Song Y; Key Laboratory of Mesoscopic Chemistry of MOE, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing, 210093, China.
  • Zhou M; Department of Electrical and Computer Engineering, University of Wisconsin, Madison, Madison, 53705, USA.
  • Lv W; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Tao L; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Feng Y; National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Song B; National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Ma Y; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Zhang J; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Xiao J; NSF Nanoscale Science and Engineering Center (NSEC), University of California, Berkeley, CA, 94720, USA.
  • Wang Y; NSF Nanoscale Science and Engineering Center (NSEC), University of California, Berkeley, CA, 94720, USA.
  • Lien DH; Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.
  • Amani M; Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.
  • Kim H; Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA.
  • Chen X; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Wu Z; School of Microelectronics, Xidian University, Xian, 710071, China.
  • Ni Z; Department of Physics, Southeast University, Nanjing, 211189, China.
  • Wang P; Department of Physics, Southeast University, Nanjing, 211189, China.
  • Shi Y; National Laboratory of Solid State Microstructures, Jiangsu Key Laboratory of Artificial Functional Materials, College of Engineering and Applied Sciences and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Ma H; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering, and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, 210093, China.
  • Zhang X; Key Laboratory of Mesoscopic Chemistry of MOE, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing, 210093, China. haibo@nju.edu.cn.
  • Xu JB; NSF Nanoscale Science and Engineering Center (NSEC), University of California, Berkeley, CA, 94720, USA.
  • Troisi A; Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, 999077, China.
  • Javey A; Department of Chemistry, University of Liverpool, Liverpool, L69 7ZD, U.K.
  • Wang X; Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, CA, 94720, USA. ajavey@berkeley.edu.
Nat Commun ; 10(1): 5589, 2019 12 06.
Article em En | MEDLINE | ID: mdl-31811122
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2019 Tipo de documento: Article