A carbene stabilized precursor for the spatial atomic layer deposition of copper thin films.
Chem Commun (Camb)
; 56(89): 13752-13755, 2020 Nov 18.
Article
em En
| MEDLINE
| ID: mdl-33063069
ABSTRACT
This paper demonstrates a carbene stabilized precursor [Cu(tBuNHC)(hmds)] with suitable volatility, reactivity and thermal stability, that enables the spatial plasma-enhanced atomic layer deposition (APP-ALD) of copper thin films at atmospheric pressure. The resulting conductive and pure copper layers were thoroughly analysed and a comparison of precursor and process with the previously reported silver analogue [Ag(tBuNHC)(hmds)] revealed interesting similarities and notable differences in precursor chemistry and growth characteristics. This first report of APP-ALD grown copper layers is an important starting point for high throughput, low-cost manufacturing of copper films for nano- and optoelectronic devices.
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MEDLINE
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En
Ano de publicação:
2020
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Article