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Large-area integration of two-dimensional materials and their heterostructures by wafer bonding.
Quellmalz, Arne; Wang, Xiaojing; Sawallich, Simon; Uzlu, Burkay; Otto, Martin; Wagner, Stefan; Wang, Zhenxing; Prechtl, Maximilian; Hartwig, Oliver; Luo, Siwei; Duesberg, Georg S; Lemme, Max C; Gylfason, Kristinn B; Roxhed, Niclas; Stemme, Göran; Niklaus, Frank.
Afiliação
  • Quellmalz A; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, Sweden. arne.quellmalz@eecs.kth.se.
  • Wang X; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, Sweden.
  • Sawallich S; Protemics GmbH, Aachen, Germany.
  • Uzlu B; Chair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen University, Aachen, Germany.
  • Otto M; Chair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen University, Aachen, Germany.
  • Wagner S; AMO GmbH, Advanced Microelectronic Center Aachen (AMICA), Aachen, Germany.
  • Wang Z; AMO GmbH, Advanced Microelectronic Center Aachen (AMICA), Aachen, Germany.
  • Prechtl M; AMO GmbH, Advanced Microelectronic Center Aachen (AMICA), Aachen, Germany.
  • Hartwig O; AMO GmbH, Advanced Microelectronic Center Aachen (AMICA), Aachen, Germany.
  • Luo S; Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München, Neubiberg, Germany.
  • Duesberg GS; Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München, Neubiberg, Germany.
  • Lemme MC; Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München, Neubiberg, Germany.
  • Gylfason KB; Institute of Physics, EIT 2, Faculty of Electrical Engineering and Information Technology, Universität der Bundeswehr München, Neubiberg, Germany.
  • Roxhed N; Chair of Electronic Devices, Faculty of Electrical Engineering and Information Technology, RWTH Aachen University, Aachen, Germany.
  • Stemme G; AMO GmbH, Advanced Microelectronic Center Aachen (AMICA), Aachen, Germany.
  • Niklaus F; Division of Micro and Nanosystems, School of Electrical Engineering and Computer Science, KTH Royal Institute of Technology, Stockholm, Sweden.
Nat Commun ; 12(1): 917, 2021 Feb 10.
Article em En | MEDLINE | ID: mdl-33568669
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article
Texto completo
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article