Your browser doesn't support javascript.
loading
High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films.
Hoque, Md Shafkat Bin; Koh, Yee Rui; Braun, Jeffrey L; Mamun, Abdullah; Liu, Zeyu; Huynh, Kenny; Liao, Michael E; Hussain, Kamal; Cheng, Zhe; Hoglund, Eric R; Olson, David H; Tomko, John A; Aryana, Kiumars; Galib, Roisul; Gaskins, John T; Elahi, Mirza Mohammad Mahbube; Leseman, Zayd C; Howe, James M; Luo, Tengfei; Graham, Samuel; Goorsky, Mark S; Khan, Asif; Hopkins, Patrick E.
Afiliação
  • Hoque MSB; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Koh YR; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Braun JL; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Mamun A; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States.
  • Liu Z; Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States.
  • Huynh K; Department of Materials Science and Engineering, University of California, Los Angeles, California 90095, United States.
  • Liao ME; Department of Materials Science and Engineering, University of California, Los Angeles, California 90095, United States.
  • Hussain K; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States.
  • Cheng Z; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.
  • Hoglund ER; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Olson DH; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Tomko JA; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Aryana K; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Galib R; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Gaskins JT; Department of Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Elahi MMM; Department of Electrical and Computer Engineering, University of New Mexico, Albuquerque, New Mexico 87131, United States.
  • Leseman ZC; Department of Mechanical Engineering, and Interdisciplinary Research Center for Advanced Materials, King Fahd University of Petroleum & Minerals, Dhahran, Eastern Province 31261, Saudi Arabia.
  • Howe JM; Department of Materials Science and Engineering, University of Virginia, Charlottesville, Virginia 22904, United States.
  • Luo T; Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, Indiana 46556, United States.
  • Graham S; George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.
  • Goorsky MS; School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States.
  • Khan A; Department of Materials Science and Engineering, University of California, Los Angeles, California 90095, United States.
  • Hopkins PE; Department of Electrical Engineering, University of South Carolina, Columbia, South Carolina 29208, United States.
ACS Nano ; 15(6): 9588-9599, 2021 Jun 22.
Article em En | MEDLINE | ID: mdl-33908771

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article