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Standards for the Characterization of Endurance in Resistive Switching Devices.
Lanza, Mario; Waser, Rainer; Ielmini, Daniele; Yang, J Joshua; Goux, Ludovic; Suñe, Jordi; Kenyon, Anthony Joseph; Mehonic, Adnan; Spiga, Sabina; Rana, Vikas; Wiefels, Stefan; Menzel, Stephan; Valov, Ilia; Villena, Marco A; Miranda, Enrique; Jing, Xu; Campabadal, Francesca; Gonzalez, Mireia B; Aguirre, Fernando; Palumbo, Felix; Zhu, Kaichen; Roldan, Juan Bautista; Puglisi, Francesco Maria; Larcher, Luca; Hou, Tuo-Hung; Prodromakis, Themis; Yang, Yuchao; Huang, Peng; Wan, Tianqing; Chai, Yang; Pey, Kin Leong; Raghavan, Nagarajan; Dueñas, Salvador; Wang, Tao; Xia, Qiangfei; Pazos, Sebastian.
Afiliação
  • Lanza M; Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia.
  • Waser R; Peter-Grünberg-Institut (PGI-7), Forschungszentrum Jülich GmbH, 52425 Jülich, Germany.
  • Ielmini D; Peter-Grünberg-Institut (PGI-10), Forschungszentrum Jülich GmbH, 52425 Jülich, Germany.
  • Yang JJ; Institut für Werkstoffe der Elektrotechnik 2 (IWE2), RWTH Aachen University, Aachen 52074, Germany.
  • Goux L; Dipartimento di Elettronica, Informazione e Bioingegneria, Politecnico di Milano and IU.NET, Piazza L. da Vinci 32, Milano, 20133, Italy.
  • Suñe J; Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California 90089, United States.
  • Kenyon AJ; Imec, Kapeldreef 75, 3001 Leuven, Belgium.
  • Mehonic A; Departament d'Enginyeria Electrònica, Universitat Autònoma de Barcelona, Barcelona 08193, Spain.
  • Spiga S; Department of Electronic and Electrical Engineering, University College London, Torrington Place, London WC1E 7JE, United Kingdom.
  • Rana V; Department of Electronic and Electrical Engineering, University College London, Torrington Place, London WC1E 7JE, United Kingdom.
  • Wiefels S; CNR-IMM, Unit of Agrate Brianza, Via C. Olivetti 2, Agrate Brianza (MB) 20864, Italy.
  • Menzel S; Peter-Grünberg-Institut (PGI-10), Forschungszentrum Jülich GmbH, 52425 Jülich, Germany.
  • Valov I; Peter-Grünberg-Institut (PGI-7), Forschungszentrum Jülich GmbH, 52425 Jülich, Germany.
  • Villena MA; Peter-Grünberg-Institut (PGI-7), Forschungszentrum Jülich GmbH, 52425 Jülich, Germany.
  • Miranda E; Peter-Grünberg-Institut (PGI-7), Forschungszentrum Jülich GmbH, 52425 Jülich, Germany.
  • Jing X; Applied Materials Inc., Via Ruini, Reggio Emilia 74L 42122, Italy.
  • Campabadal F; Departament d'Enginyeria Electrònica, Universitat Autònoma de Barcelona, Barcelona 08193, Spain.
  • Gonzalez MB; School of Materials Science and Engineering, Jiangsu Key Laboratory of Advanced Metallic Materials, Southeast University, Nanjing 211189, China.
  • Aguirre F; Institut de Microelectrònica de Barcelona-Centre Nacional de Microelectrònica, Consejo Superior de Investigaciones Científicas, Bellaterra 08193, Spain.
  • Palumbo F; Institut de Microelectrònica de Barcelona-Centre Nacional de Microelectrònica, Consejo Superior de Investigaciones Científicas, Bellaterra 08193, Spain.
  • Zhu K; Unidad de Investigación y Desarrollo de las Ingenierías-CONICET, Facultad Regional Buenos Aires, Universidad Tecnológica Nacional (UIDI-CONICET/FRBA-UTN), Buenos Aires, Medrano 951(C1179AAQ), Argentina.
  • Roldan JB; Unidad de Investigación y Desarrollo de las Ingenierías-CONICET, Facultad Regional Buenos Aires, Universidad Tecnológica Nacional (UIDI-CONICET/FRBA-UTN), Buenos Aires, Medrano 951(C1179AAQ), Argentina.
  • Puglisi FM; Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia.
  • Larcher L; Departamento de Electrónica y Tecnología de Computadores, Facultad de Ciencias, Universidad de Granada, Avd. Fuentenueva s/n, Granada 18071, Spain.
  • Hou TH; Dipartimento di Ingegneria "Enzo Ferrari", Università di Modena e Reggio Emilia, Via P. Vivarelli 10/1, Modena 41125, Italy.
  • Prodromakis T; Applied Materials Inc., Via Ruini, Reggio Emilia 74L 42122, Italy.
  • Yang Y; Department of Electronics Engineering and Institute of Electronics, National Yang Ming Chiao Tung University, Hsinchu 300, Taiwan.
  • Huang P; Centre for Electronics Frontiers, University of Southampton, Southampton SO171BJ, United Kingdom.
  • Wan T; Key Laboratory of Microelectronic Devices and Circuits (MOE), Department of Micro/nanoelectronics, Peking University, Beijing 100871, China.
  • Chai Y; Key Laboratory of Microelectronic Devices and Circuits (MOE), Department of Micro/nanoelectronics, Peking University, Beijing 100871, China.
  • Pey KL; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong.
  • Raghavan N; Department of Applied Physics, The Hong Kong Polytechnic University, Kowloon, Hong Kong.
  • Dueñas S; Engineering Product Development, Singapore University of Technology and Design (SUTD), 8 Somapah Road, 487372 Singapore.
  • Wang T; Engineering Product Development, Singapore University of Technology and Design (SUTD), 8 Somapah Road, 487372 Singapore.
  • Xia Q; Department of Electronics, University of Valladolid, Paseo de Belén 15, Valladolid E-47011, Spain.
  • Pazos S; Institute of Functional Nano and Soft Materials (FUNSOM), Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University 199 Ren-Ai Road, Suzhou 215123, China.
ACS Nano ; 15(11): 17214-17231, 2021 Nov 23.
Article em En | MEDLINE | ID: mdl-34730935
ABSTRACT
Resistive switching (RS) devices are emerging electronic components that could have applications in multiple types of integrated circuits, including electronic memories, true random number generators, radiofrequency switches, neuromorphic vision sensors, and artificial neural networks. The main factor hindering the massive employment of RS devices in commercial circuits is related to variability and reliability issues, which are usually evaluated through switching endurance tests. However, we note that most studies that claimed high endurances >106 cycles were based on resistance versus cycle plots that contain very few data points (in many cases even <20), and which are collected in only one device. We recommend not to use such a characterization method because it is highly inaccurate and unreliable (i.e., it cannot reliably demonstrate that the device effectively switches in every cycle and it ignores cycle-to-cycle and device-to-device variability). This has created a blurry vision of the real performance of RS devices and in many cases has exaggerated their potential. This article proposes and describes a method for the correct characterization of switching endurance in RS devices; this method aims to construct endurance plots showing one data point per cycle and resistive state and combine data from multiple devices. Adopting this recommended method should result in more reliable literature in the field of RS technologies, which should accelerate their integration in commercial products.
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2021 Tipo de documento: Article