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Mutually Noninterfering Flexible Pressure-Temperature Dual-Modal Sensors Based on Conductive Metal-Organic Framework for Electronic Skin.
Li, Yuxiang; Wang, Ranran; Wang, Guan-E; Feng, Shiyang; Shi, Wenge; Cheng, Yin; Shi, Liangjing; Fu, Kaiyuan; Sun, Jing.
Afiliação
  • Li Y; State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 1295 Ding Xi Road, Shanghai 200050, China.
  • Wang R; Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, 19 Yuquan Road, Beijing 100049, China.
  • Wang GE; State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, 1295 Ding Xi Road, Shanghai 200050, China.
  • Feng S; School of Chemistry and Materials Science, Hangzhou Institute for Advanced Study, University of Chinese Academy of Sciences, 1 Sub-lane Xiangshan, Hangzhou 310024, China.
  • Shi W; State Key Laboratory of Structural Chemistry, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Sciences, 155 Yangqiao West Road, Fuzhou 350002, China.
  • Cheng Y; Central Laboratory, Peking University School and Hospital of Stomatology, 22 Zhongguancun South Avenue, Beijing 100081, China.
  • Shi L; National Clinical Research Center for Oral Diseases, 22 Zhongguancun South Avenue, Beijing 100081, China.
  • Fu K; Central Laboratory, Peking University School and Hospital of Stomatology, 22 Zhongguancun South Avenue, Beijing 100081, China.
  • Sun J; National Clinical Research Center for Oral Diseases, 22 Zhongguancun South Avenue, Beijing 100081, China.
ACS Nano ; 16(1): 473-484, 2022 Jan 25.
Article em En | MEDLINE | ID: mdl-34918906

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Estruturas Metalorgânicas / Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2022 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Estruturas Metalorgânicas / Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2022 Tipo de documento: Article