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Antimicrobial second skin using copper nanomesh.
Kim, Jae Joon; Ha, Siyoung; Kim, Lina; Kato, Yutaro; Wang, Yan; Okutani, Chihiro; Wang, Haoyang; Wang, Chunya; Fukuda, Kenjiro; Lee, Sunghoon; Yokota, Tomoyuki; Kwon, Oh Seok; Someya, Takao.
Afiliação
  • Kim JJ; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Ha S; Infectious Disease Research Center, Korea Research Institute of Bioscience and Biotechnology (KRIBB), Daejeon 34141, South Korea.
  • Kim L; Infectious Disease Research Center, Korea Research Institute of Bioscience and Biotechnology (KRIBB), Daejeon 34141, South Korea.
  • Kato Y; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Wang Y; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Okutani C; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Wang H; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Wang C; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Fukuda K; Center for Emergent Matter Science & Thin-Film Device Laboratory RIKEN 2-1 Hirosawa, Wako, Saitama 351-0198, Japan.
  • Lee S; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Yokota T; Department of Electrical Engineering and Information Systems, The University of Tokyo, Bunkyo-Ku, Tokyo 113-8656, Japan.
  • Kwon OS; Infectious Disease Research Center, Korea Research Institute of Bioscience and Biotechnology (KRIBB), Daejeon 34141, South Korea.
  • Someya T; Department of Nanobiotechnology, Korea University of Science and Technology (UST), Daejeon 34141, South Korea.
Proc Natl Acad Sci U S A ; 119(24): e2200830119, 2022 06 14.
Article em En | MEDLINE | ID: mdl-35679344
ABSTRACT
The functional support and advancement of our body while preserving inherent naturalness is one of the ultimate goals of bioengineering. Skin protection against infectious pathogens is an application that requires common and long-term wear without discomfort or distortion of the skin functions. However, no antimicrobial method has been introduced to prevent cross-infection while preserving intrinsic skin conditions. Here, we propose an antimicrobial skin protection platform copper nanomesh, which prevents cross-infectionmorphology, temperature change rate, and skin humidity. Copper nanomesh exhibited an inactivation rate of 99.99% for Escherichia coli bacteria and influenza virus A within 1 and 10 min, respectively. The thin and porous nanomesh allows for conformal coating on the fingertips, without significant interference with the rate of skin temperature change and humidity. Efficient cross-infection prevention and thermal transfer of copper nanomesh were demonstrated using direct on-hand experiments.
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Pele / Infecção Hospitalar / Cobre / Nanopartículas Metálicas / Anti-Infecciosos Idioma: En Ano de publicação: 2022 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Pele / Infecção Hospitalar / Cobre / Nanopartículas Metálicas / Anti-Infecciosos Idioma: En Ano de publicação: 2022 Tipo de documento: Article