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Large Memory Window of van der Waals Heterostructure Devices Based on MOCVD-Grown 2D Layered Ge4 Se9.
Noh, Gichang; Song, Hwayoung; Choi, Heenang; Kim, Mingyu; Jeong, Jae Hwan; Lee, Yongjoon; Choi, Min-Yeong; Oh, Saeyoung; Jo, Min-Kyung; Woo, Dong Yeon; Jo, Yooyeon; Park, Eunpyo; Moon, Eoram; Kim, Tae Soo; Chai, Hyun-Jun; Huh, Woong; Lee, Chul-Ho; Kim, Cheol-Joo; Yang, Heejun; Song, Senugwoo; Jeong, Hu Young; Kim, Yong-Sung; Lee, Gwan-Hyoung; Lim, Jongsun; Kim, Chang Gyoun; Chung, Taek-Mo; Kwak, Joon Young; Kang, Kibum.
Afiliação
  • Noh G; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Song H; Center for Neuromorphic Engineering, Korea Institute Science and Technology (KIST), Seoul, 02792, Korea.
  • Choi H; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Kim M; Thin Film Materials Research Center, Korea Research Institute of Chemical Technology (KRICT), Daejeon, 34114, Korea.
  • Jeong JH; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Lee Y; Department of Materials Science and Engineering, Yonsei University, Seoul, 03722, Korea.
  • Choi MY; Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Oh S; Department of Chemical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 37673, Korea.
  • Jo MK; Graduate School of Semiconductor Materials and Devices Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan, 44919, Korea.
  • Woo DY; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Jo Y; Operando Methodology and Measurement Team, Korea Research Institute of Standards & Science (KRISS), Daejeon, 34113, Korea.
  • Park E; Center for Neuromorphic Engineering, Korea Institute Science and Technology (KIST), Seoul, 02792, Korea.
  • Moon E; Center for Neuromorphic Engineering, Korea Institute Science and Technology (KIST), Seoul, 02792, Korea.
  • Kim TS; Center for Neuromorphic Engineering, Korea Institute Science and Technology (KIST), Seoul, 02792, Korea.
  • Chai HJ; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Huh W; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Lee CH; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Kim CJ; KU-KIST Graduate School of Converging Science and Technology, Korea University, Seoul, 02841, Korea.
  • Yang H; KU-KIST Graduate School of Converging Science and Technology, Korea University, Seoul, 02841, Korea.
  • Song S; Advanced Materials Research Division, Korea Institute of Science and Technology (KIST), Seoul, 02792, Korea.
  • Jeong HY; Department of Chemical Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 37673, Korea.
  • Kim YS; Department of Physics, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Korea.
  • Lee GH; Operando Methodology and Measurement Team, Korea Research Institute of Standards & Science (KRISS), Daejeon, 34113, Korea.
  • Lim J; Graduate School of Semiconductor Materials and Devices Engineering, Ulsan National Institute of Science and Technology (UNIST), Ulsan, 44919, Korea.
  • Kim CG; Low-Dimensional Material Team, Korea Research Institute of Standards and Science (KRISS), Daejeon, 34113, Korea.
  • Chung TM; Department of Materials Science and Engineering, Seoul National University, Seoul, 08826, Korea.
  • Kwak JY; Thin Film Materials Research Center, Korea Research Institute of Chemical Technology (KRICT), Daejeon, 34114, Korea.
  • Kang K; Thin Film Materials Research Center, Korea Research Institute of Chemical Technology (KRICT), Daejeon, 34114, Korea.
Adv Mater ; 34(41): e2204982, 2022 Oct.
Article em En | MEDLINE | ID: mdl-36000232
ABSTRACT
Van der Waals (vdW) heterostructures have drawn much interest over the last decade owing to their absence of dangling bonds and their intriguing low-dimensional properties. The emergence of 2D materials has enabled the achievement of significant progress in both the discovery of physical phenomena and the realization of superior devices. In this work, the group IV metal chalcogenide 2D-layered Ge4 Se9 is introduced as a new selection of insulating vdW material. 2D-layered Ge4 Se9 is synthesized with a rectangular shape using the metalcorganic chemical vapor deposition system using a liquid germanium precursor at 240 °C. By stacking the Ge4 Se9 and MoS2 , vdW heterostructure devices are fabricated with a giant memory window of 129 V by sweeping back gate range of ±80 V. The gate-independent decay time reveals that the large hysteresis is induced by the interfacial charge transfer, which originates from the low band offset. Moreover, repeatable conductance changes are observed over the 2250 pulses with low non-linearity values of 0.26 and 0.95 for potentiation and depression curves, respectively. The energy consumption of the MoS2 /Ge4 Se9 device is about 15 fJ for operating energy and the learning accuracy of image classification reaches 88.3%, which further proves the great potential of artificial synapses.
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article