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A minimized and efficient low temperature loading device for indentation.
Wang, S B; Wu, O Y; Li, S R; Wang, Y Y; Zhao, H W.
Afiliação
  • Wang SB; School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130025, China.
  • Wu OY; School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130025, China.
  • Li SR; School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130025, China.
  • Wang YY; School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130025, China.
  • Zhao HW; School of Mechanical and Aerospace Engineering, Jilin University, Changchun 130025, China.
Rev Sci Instrum ; 93(9): 093902, 2022 Sep 01.
Article em En | MEDLINE | ID: mdl-36182450
ABSTRACT
A minimized and efficient low temperature loading device cooling with Peltier coolers for indentation test is developed. Both specimen and indentation tip are immersed in 50% methanol-water solution, totally eliminating the contact thermal drift problem. Low temperature indentation tests down to 253.8 K can be realized within 10 min. The size of the device is miniaturized within 50 × 40 × 30 mm3, and no vacuum environment is required. Monocrystalline copper is tested to perform the feasibility of the device. Based on the simple structure and stable experimental effect, the developed device can be integrated into various types of current indentation devices to attach low temperature testing ability.

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2022 Tipo de documento: Article