Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires.

Weng, Wei-Lun; Chen, Hsin-Yu; Ting, Yi-Hsin; Chen, Hsin-Yi Tiffany; Wu, Wen-Wei; Tu, King-Ning; Liao, Chien-Neng.

Afiliação

Weng WL; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu30013, Taiwan, ROC.
Chen HY; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu30013, Taiwan, ROC.
Ting YH; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu30013, Taiwan, ROC.
Chen HT; Department of Engineering and System Science, National Tsing Hua University, Hsinchu30013, Taiwan, ROC.
Wu WW; Department of Materials Science and Engineering, National Yang Ming Chiao Tung University, Hsinchu30013, Taiwan, ROC.
Tu KN; Department of Materials Science and Engineering and Department of Electrical Engineering, City University of Hong Kong, Kowloon, Hong Kong.
Liao CN; Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu30013, Taiwan, ROC.

Nano Lett ; 22(22): 9071-9076, 2022 Nov 23.

Article em En | MEDLINE | ID: mdl-36342418