Fabrication of Aluminum Oxide Thin-Film Devices Based on Atomic Layer Deposition and Pulsed Discrete Feed Method.

Lin, Shih-Chin; Wang, Ching-Chiun; Tien, Chuen-Lin; Tung, Fu-Ching; Wang, Hsuan-Fu; Lai, Shih-Hsiang

Lin, Shih-Chin; Wang, Ching-Chiun; Tien, Chuen-Lin; Tung, Fu-Ching; Wang, Hsuan-Fu; Lai, Shih-Hsiang.

Afiliação

Lin SC; Mechanical and Systems Research Lab, Industrial Technology Research Institute, Hsinchu 310401, Taiwan.
Wang CC; Mechanical and Systems Research Lab, Industrial Technology Research Institute, Hsinchu 310401, Taiwan.
Tien CL; Department of Electrical Engineering, Feng Chia University, Taichung 40724, Taiwan.
Tung FC; Mechanical and Systems Research Lab, Industrial Technology Research Institute, Hsinchu 310401, Taiwan.
Wang HF; Mechanical and Systems Research Lab, Industrial Technology Research Institute, Hsinchu 310401, Taiwan.
Lai SH; Mechanical and Systems Research Lab, Industrial Technology Research Institute, Hsinchu 310401, Taiwan.

Micromachines (Basel) ; 14(2)2023 Jan 21.

Article em En | MEDLINE | ID: mdl-36837979

Palavras-chave

aluminum oxide; atomic layer deposition; buffer layer; mechanical stress; plasma-enhanced chemical vapor deposition; pulsed discrete feed method; thin film

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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article

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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article