Research Progress on Bonding Wire for Microelectronic Packaging.

Zhou, Hongliang; Zhang, Yingchong; Cao, Jun; Su, Chenghao; Li, Chong; Chang, Andong; An, Bin.

Afiliação

Zhou H; School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
Zhang Y; School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
Cao J; School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
Su C; School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
Li C; School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
Chang A; School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.
An B; School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000, China.

Micromachines (Basel) ; 14(2)2023 Feb 11.

Article em En | MEDLINE | ID: mdl-36838134