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Technology Roadmap for Flexible Sensors.
Luo, Yifei; Abidian, Mohammad Reza; Ahn, Jong-Hyun; Akinwande, Deji; Andrews, Anne M; Antonietti, Markus; Bao, Zhenan; Berggren, Magnus; Berkey, Christopher A; Bettinger, Christopher John; Chen, Jun; Chen, Peng; Cheng, Wenlong; Cheng, Xu; Choi, Seon-Jin; Chortos, Alex; Dagdeviren, Canan; Dauskardt, Reinhold H; Di, Chong-An; Dickey, Michael D; Duan, Xiangfeng; Facchetti, Antonio; Fan, Zhiyong; Fang, Yin; Feng, Jianyou; Feng, Xue; Gao, Huajian; Gao, Wei; Gong, Xiwen; Guo, Chuan Fei; Guo, Xiaojun; Hartel, Martin C; He, Zihan; Ho, John S; Hu, Youfan; Huang, Qiyao; Huang, Yu; Huo, Fengwei; Hussain, Muhammad M; Javey, Ali; Jeong, Unyong; Jiang, Chen; Jiang, Xingyu; Kang, Jiheong; Karnaushenko, Daniil; Khademhosseini, Ali; Kim, Dae-Hyeong; Kim, Il-Doo; Kireev, Dmitry; Kong, Lingxuan.
Afiliação
  • Luo Y; Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore.
  • Abidian MR; Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore.
  • Ahn JH; Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States.
  • Akinwande D; School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea.
  • Andrews AM; Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States.
  • Antonietti M; Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States.
  • Bao Z; Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, Unit
  • Berggren M; Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany.
  • Berkey CA; Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States.
  • Bettinger CJ; Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden.
  • Chen J; Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden.
  • Chen P; Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States.
  • Cheng W; Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States.
  • Cheng X; Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States.
  • Choi SJ; School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore.
  • Chortos A; Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800.
  • Dagdeviren C; Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800.
  • Dauskardt RH; Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China.
  • Di CA; Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea.
  • Dickey MD; School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States.
  • Duan X; Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
  • Facchetti A; Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States.
  • Fan Z; Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China.
  • Fang Y; Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States.
  • Feng J; Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States.
  • Feng X; Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States.
  • Gao H; Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China.
  • Gao W; School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore.
  • Gong X; State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China.
  • Guo CF; Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China.
  • Guo X; School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore.
  • Hartel MC; Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore.
  • He Z; Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States.
  • Ho JS; Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States.
  • Hu Y; Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
  • Huang Q; National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China.
  • Huang Y; Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States.
  • Huo F; Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China.
  • Hussain MM; Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore.
  • Javey A; Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore.
  • Jeong U; The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore.
  • Jiang C; School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China.
  • Jiang X; School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China.
  • Kang J; Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States.
  • Karnaushenko D; Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China.
  • Khademhosseini A; mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States.
  • Kim DH; Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States.
  • Kim ID; Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States.
  • Kireev D; Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea.
  • Kong L; Department of Electronic Engineering, Tsinghua University, Beijing 100084, China.
ACS Nano ; 17(6): 5211-5295, 2023 03 28.
Article em En | MEDLINE | ID: mdl-36892156
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2023 Tipo de documento: Article
Texto completo
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PubMed Links
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Texto completo: 1 Base de dados: MEDLINE Assunto principal: Dispositivos Eletrônicos Vestíveis Idioma: En Ano de publicação: 2023 Tipo de documento: Article