Improving Thermal Conductivity and Tribological Performance of Polyimide by Filling Cu, CNT, and Graphene.

Liu, Chen; Song, Jingfu; Zhao, Gai; Yin, Yuhang; Ding, Qingjun.

Afiliação

Liu C; State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
Song J; School of Naval Architecture & Ocean Engineering, Jiangsu Maritime Institute, Nanjing 211170, China.
Zhao G; State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.
Yin Y; State Key Laboratory of Bio-Fibers and Eco-Textiles, Qingdao University, Qingdao 266071, China.
Ding Q; State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China.

Micromachines (Basel) ; 14(3)2023 Mar 07.

Article em En | MEDLINE | ID: mdl-36985023