The Effect of Surface Electroplating on Fragment Deformation Behavior When Subjected to Contact Blasts.

Meng, Yuanpei; He, Yuan; Wang, Chuanting; Ma, Yue; Guo, Lei; Jiao, Junjie; He, Yong.

Afiliação

Meng Y; School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.
He Y; School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.
Wang C; School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.
Ma Y; School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.
Guo L; School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.
Jiao J; School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.
He Y; School of Mechanical Engineering, Nanjing University of Science and Technology, Nanjing 210094, China.

Materials (Basel) ; 16(15)2023 Aug 04.

Article em En | MEDLINE | ID: mdl-37570168