A low-profile electromechanical packaging system for soft-to-flexible bioelectronic interfaces.

Fallegger, Florian; Trouillet, Alix; Coen, Florent-Valéry; Schiavone, Giuseppe; Lacour, Stéphanie P.

Afiliação

Fallegger F; Laboratory for Soft Bioelectronic Interfaces, Neuro-X Institute, Ecole Polytechnique Fédérale de Lausanne, Geneva, Switzerland.
Trouillet A; Laboratory for Soft Bioelectronic Interfaces, Neuro-X Institute, Ecole Polytechnique Fédérale de Lausanne, Geneva, Switzerland.
Coen FV; Laboratory for Soft Bioelectronic Interfaces, Neuro-X Institute, Ecole Polytechnique Fédérale de Lausanne, Geneva, Switzerland.
Schiavone G; Laboratory for Soft Bioelectronic Interfaces, Neuro-X Institute, Ecole Polytechnique Fédérale de Lausanne, Geneva, Switzerland.
Lacour SP; Laboratory for Soft Bioelectronic Interfaces, Neuro-X Institute, Ecole Polytechnique Fédérale de Lausanne, Geneva, Switzerland.

APL Bioeng ; 7(3): 036109, 2023 Sep.

Article em En | MEDLINE | ID: mdl-37600068

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article