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Defect Engineering of 2D Semiconductors for Dual Control of Emission and Carrier Polarity.
Chen, Ying; Liu, Huawei; Yu, Guoliang; Ma, Chao; Xu, Zheyuan; Zhang, Jinding; Zhang, Cheng; Chen, Mingxing; Li, Dong; Zheng, Weihao; Luo, Ziyu; Yang, Xin; Li, Kaihui; Yao, Chengdong; Zhang, Danliang; Xu, Boyi; Yi, Jiali; Yi, Chen; Li, Bo; Zhang, Hongmei; Zhang, Zucheng; Zhu, Xiaoli; Li, Siyu; Chen, Shula; Jiang, Ying; Pan, Anlian.
Afiliação
  • Chen Y; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Liu H; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Yu G; School of Physics and Electronics, Hunan Normal University, Changsha, Hunan, 410081, China.
  • Ma C; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Xu Z; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Zhang J; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Zhang C; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Chen M; School of Physics and Electronics, Hunan Normal University, Changsha, Hunan, 410081, China.
  • Li D; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Zheng W; College of Advanced Interdisciplinary Studies & Hunan Provincial Key Laboratory of Novel Nano Optoelectronic Information Materials and Devices, National University of Defense Technology, Changsha, Hunan, 410073, China.
  • Luo Z; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Yang X; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Li K; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Yao C; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Zhang D; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Xu B; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Yi J; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Yi C; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Li B; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Zhang H; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Zhang Z; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Zhu X; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Li S; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Chen S; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Jiang Y; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
  • Pan A; Key Laboratory for Micro-Nano Physics and Technology of Hunan Province, Hunan Institute of Optoelectronic Integration, College of Materials Science and Engineering, School of Physics and Electronics, Hunan University, Changsha, Hunan, 410082, P. R. China.
Adv Mater ; 36(14): e2312425, 2024 Apr.
Article em En | MEDLINE | ID: mdl-38146671
ABSTRACT
2D transition metal dichalcogenides (TMDCs) are considered as promising materials in post-Moore technology. However, the low photoluminescence quantum yields (PLQY) and single carrier polarity due to the inevitable defects during material preparation are great obstacles to their practical applications. Here, an extraordinary defect engineering strategy is reported based on first-principles calculations and realize it experimentally on WS2 monolayers by doping with IIIA atoms. The doped samples with large sizes possess both giant PLQY enhancement and effective carrier polarity modulation. Surprisingly, the high PL emission maintained even after one year under ambient environment. Moreover, the constructed p-n homojunctions shows high rectification ratio (≈2200), ultrafast response times and excellent stability. Meanwhile, the doping strategy is universally applicable to other TMDCs and dopants. This smart defect engineering strategy not only provides a general scheme to eliminate the negative influence of defects, but also utilize them to achieve desired optoelectronic properties for multifunctional applications.
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article
Texto completo
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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article