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A biodegradable and flexible neural interface for transdermal optoelectronic modulation and regeneration of peripheral nerves.
Sun, Pengcheng; Li, Chaochao; Yang, Can; Sun, Mengchun; Hou, Hanqing; Guan, Yanjun; Chen, Jinger; Liu, Shangbin; Chen, Kuntao; Ma, Yuan; Huang, Yunxiang; Li, Xiangling; Wang, Huachun; Wang, Liu; Chen, Shengfeng; Cheng, Haofeng; Xiong, Wei; Sheng, Xing; Zhang, Milin; Peng, Jiang; Wang, Shirong; Wang, Yu; Yin, Lan.
Afiliação
  • Sun P; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Li C; Institute of Orthopedics, Chinese PLA General Hospital, Beijing Key Lab of Regenerative Medicine in Orthopedics, Key Laboratory of Musculoskeletal Trauma and Injuries PLA, No. 28 Fuxing Road, Beijing, 100853, P. R. China.
  • Yang C; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Sun M; Institute of Orthopedics, Chinese PLA General Hospital, Beijing Key Lab of Regenerative Medicine in Orthopedics, Key Laboratory of Musculoskeletal Trauma and Injuries PLA, No. 28 Fuxing Road, Beijing, 100853, P. R. China.
  • Hou H; School of Life Sciences, Tsinghua University, Beijing, 100084, P. R. China.
  • Guan Y; Institute of Orthopedics, Chinese PLA General Hospital, Beijing Key Lab of Regenerative Medicine in Orthopedics, Key Laboratory of Musculoskeletal Trauma and Injuries PLA, No. 28 Fuxing Road, Beijing, 100853, P. R. China.
  • Chen J; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Liu S; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Chen K; School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Ma Y; Department of Electronic Engineering, Tsinghua University, Beijing, 100084, P. R. China.
  • Huang Y; Thayer School of Engineering, Dartmouth College, Hanover, NH, 03755, USA.
  • Li X; Institute of Orthopedics, Chinese PLA General Hospital, Beijing Key Lab of Regenerative Medicine in Orthopedics, Key Laboratory of Musculoskeletal Trauma and Injuries PLA, No. 28 Fuxing Road, Beijing, 100853, P. R. China.
  • Wang H; Department of Rehabilitation, Tongji Hospital, Tongji Medical College, Huazhong University of Science and Technology, Wuhan, 430030, P. R. China.
  • Wang L; School of Integrated Circuits, Shenzhen Campus of Sun Yat-sen University, Shenzhen, 518107, P. R. China.
  • Chen S; School of Biological Science and Medical Engineering, Key Laboratory of Biomechanics and Mechanobiology of Ministry of Education, Beijing Advanced Innovation Center for Biomedical Engineering, Beihang University, Beijing, 100083, P. R. China.
  • Cheng H; School of Engineering Medicine, Beihang University, Beijing, 100083, P. R. China.
  • Xiong W; Institute of Orthopedics, Chinese PLA General Hospital, Beijing Key Lab of Regenerative Medicine in Orthopedics, Key Laboratory of Musculoskeletal Trauma and Injuries PLA, No. 28 Fuxing Road, Beijing, 100853, P. R. China.
  • Sheng X; Institute of Orthopedics, Chinese PLA General Hospital, Beijing Key Lab of Regenerative Medicine in Orthopedics, Key Laboratory of Musculoskeletal Trauma and Injuries PLA, No. 28 Fuxing Road, Beijing, 100853, P. R. China.
  • Zhang M; Chinese Institute for Brain Research, Beijing, 102206, P. R. China.
  • Peng J; Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China.
  • Wang S; Institute for Precision Medicine, Tsinghua University, Beijing, 100084, P. R. China.
  • Wang Y; IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, P. R. China.
  • Yin L; Department of Electronic Engineering, Tsinghua University, Beijing, 100084, P. R. China.
Nat Commun ; 15(1): 4721, 2024 Jun 03.
Article em En | MEDLINE | ID: mdl-38830884
ABSTRACT
Optoelectronic neural interfaces can leverage the photovoltaic effect to convert light into electrical current, inducing charge redistribution and enabling nerve stimulation. This method offers a non-genetic and remote approach for neuromodulation. Developing biodegradable and efficient optoelectronic neural interfaces is important for achieving transdermal stimulation while minimizing infection risks associated with device retrieval, thereby maximizing therapeutic outcomes. We propose a biodegradable, flexible, and miniaturized silicon-based neural interface capable of transdermal optoelectronic stimulation for neural modulation and nerve regeneration. Enhancing the device interface with thin-film molybdenum significantly improves the efficacy of neural stimulation. Our study demonstrates successful activation of the sciatic nerve in rodents and the facial nerve in rabbits. Moreover, transdermal optoelectronic stimulation accelerates the functional recovery of injured facial nerves.
Assuntos

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Nervo Isquiático / Regeneração Nervosa Idioma: En Ano de publicação: 2024 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Assunto principal: Nervo Isquiático / Regeneração Nervosa Idioma: En Ano de publicação: 2024 Tipo de documento: Article