Your browser doesn't support javascript.
loading
Synergistic Improvement in the Thermal Conductivity of Hybrid Boron Nitride Nanotube/Nanosheet Epoxy Composites.
Mohanraman, Rajeshkumar; Steiner, Pietro; Kocabas, Coskun; Kinloch, Ian A; Bissett, Mark A.
Afiliação
  • Mohanraman R; Department of Materials, Henry Royce Institute, National Graphene Institute, University of Manchester, Manchester M13 9PL, U.K.
  • Steiner P; Department of Materials, Henry Royce Institute, National Graphene Institute, University of Manchester, Manchester M13 9PL, U.K.
  • Kocabas C; Department of Materials, Henry Royce Institute, National Graphene Institute, University of Manchester, Manchester M13 9PL, U.K.
  • Kinloch IA; Department of Materials, Henry Royce Institute, National Graphene Institute, University of Manchester, Manchester M13 9PL, U.K.
  • Bissett MA; Department of Materials, Henry Royce Institute, National Graphene Institute, University of Manchester, Manchester M13 9PL, U.K.
ACS Appl Nano Mater ; 7(11): 13142-13146, 2024 Jun 14.
Article em En | MEDLINE | ID: mdl-38912122
ABSTRACT
Epoxy composites with excellent thermal properties are highly promising for thermal management applications in modern electronic devices. In this work, we report the enhancement of the thermal conductivity of two different nanocomposites, using epoxy resins LY564 (epoxy 1) and LY5052 (epoxy 2), by incorporating multiwalled boron nitride nanotubes (BNNT) and boron nitride nanosheets (BNNS) as fillers. The synergistic interaction between the 1D BNNT and 2D BNNS allows for improved thermal conductivity via several different mechanisms. The highest thermal conductivity was measured at a loading of 1/30 wt % of BNNT/BNNS, resulting in values of 2.6 and 3.4 Wm-1 K-1, respectively, for each epoxy matrix. This improvement is attributed to the formation of a three-dimensional heat flow path formed through intercalation of the nanotubes between the BNNS. The thermal conductivity of the epoxy 1 and 2 nanocomposites improved by 940 and 1500%, respectively, making them suitable as thermal interface materials in electronic applications requiring electrical resistivity.

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2024 Tipo de documento: Article