RESUMEN
Manipulations of carrier and phonon scatterings through hierarchical structures have been proved to be effective in improving thermoelectric performance. Previous efforts in GeTe-based materials mainly focus on simultaneously optimizing the carrier concentration and band structure. In this work, a synergistic strategy to tailor thermal and electrical transport properties of GeTe by combination with the scattering effects from both Ge vacancies and other defects is reported. The addition of Fe in GeTe-based compounds introduces the secondary phase of FeGe2 , synchronously increasing the concentration of Ge vacancies and arousing more Ge planar defects. These hierarchical defects contribute to a large scattering factor, leading to a significant enhancement of Seebeck coefficient and further a splendid power factor. Meanwhile, benefiting from the reinforced phonon scatterings by multiscale hierarchical structures, an extremely low lattice thermal conductivity is successfully achieved. With simultaneously optimized electrical and thermal transport properties, a maximum figure of merit, zT, value of 2.1 at 750 K and an average zT value of 1.5 in 400-800 K are realized in Ge0.875 Sb0.08 Te/1.5%FeGe2 . This work demonstrates that manipulation of hierarchical defects is an effective strategy to optimize the thermoelectric properties.
RESUMEN
Thermoelectric cooling devices utilizing Bi2Te3-based alloys have seen increased utilization in recent years. However, their thermoelectric performance remains inadequate within the operational temperature range (≤400 K), with limited research addressing this issue. In this study, we successfully modulated the carrier concentration of the sample through Te content reduction, consequently lowering the peak temperature of the zT value from 400 to 300 K. This led to a substantial enhancement in thermoelectric performance at room temperature (≤400 K). Furthermore, by doping with La, the electrical transport properties have been further optimized, and the lattice thermal conductivity has been effectively reduced at the same time; the average zT value was ultimately elevated from 0.69 to 0.9 within the temperature range of 300-400 K. These findings hold significant promise for enhancing the efficacy of existing thermoelectric cooling devices based on Bi2Te3-based alloys.
RESUMEN
GeTe-based materials with superior thermoelectric properties promise great potential for waste heat recovery. However, the lack of appropriate diffusion barrier materials (DBMs) limits not only the energy conversion efficiency but also the service reliability of the thermoelectric devices. Here, we propose a design strategy based on phase equilibria diagrams from first-principles calculations and identify transition metal germanides (e.g., NiGe and FeGe2) as the DBMs. Our validation experiment confirms the excellent chemical and mechanical stabilities of the interfaces between the germanides and GeTe. We also develop a process for scaling up the GeTe production. Combining with module geometry optimization, we fabricate an eight-pair module using mass-produced p-type Ge0.89Cu0.06Sb0.08Te and n-type Yb0.3Co4Sb12 and achieve a record-high efficiency of 12% among all reported single-stage thermoelectric modules. Our work thus paves the way for waste heat recovery based on completely lead-free thermoelectric technology.
RESUMEN
The utility of a solvent is one of the key factors that impacts resultant film morphology. However, the effect of solvent-dependent morphology on the doping process and electrical conductivity has not been adequately elucidated. In this work, we compared the morphology of chloroform- and chlorobenzene-processed thiophene polymer films and investigated how the choice of solvent influences film morphology, doping level, charge transport properties, and thus electrical conductivity. It was found that the film drop-casted from chloroform exhibits better crystallinity than that drop-casted from chlorobenzene. The crystallinity has negligible impact on the doping level but significant impact on charge transport properties. As a result, the chloroform-processed film shows a higher electrical conductivity of up to 408 S cm-1 due to a high carrier mobility related to the continuously crystalline domains in film. This finding indicates that the choice of solvent for preparation of film, which strongly correlated with molecular orientation, is a new strategy to optimize the electrical conductivity of doped polymers.
RESUMEN
Unsatisfied electrode bonding in half-Heusler devices renders thermal damage and large efficiency loss, which limits their practical service at high temperatures. Here, we develop a thermodynamic strategy to screen barrier layer elements. Theoretically, we found that the interface between VIIB elements and half-Heuslers possesses near-zero interfacial reaction energy and large atomic diffusion barrier. Experimentally, such an interphase proves to be the atomic direct bonding and has high thermal stability at 1073 K, leading to ideal ohmic contact. Such thermally inert and ohmic contact interface enable modules stably to work at elevated temperature up to 1100 K, which releases the peak performance of half-Heuslers and in turn boosts the energy conversion efficiencies to the records of 11.1% and 13.3% for half-Heusler single-stage and half-Heusler/Bi2Te3 segmented modules. This design strategy provides a feasible solution for the high-temperature half-Heusler generators and gives enlightenment for other package interconnection design of electronic devices.
RESUMEN
Skutterudites CoSb(3) with multiple cofillers Ba, La, and Yb were synthesized and very high thermoelectric figure of merit ZT = 1.7 at 850 K was realized. X-ray diffraction of the densified multiple-filled bulk samples reveals all samples are phase pure. High-resolution scanning transmission electron microscopy (STEM) and energy dispersive X-ray spectroscopy (EDS) analysis confirm that multiple guest fillers occupy the nanoscale-cages in the skutterudites. The fillers are further shown to be uniformly distributed and the Co-Sb skutterudite framework is virtually unperturbed from atomic scale to a few micrometers. Our results firmly show that high power factors can be realized by adjusting the total filling fraction of fillers with different charge states to reach the optimum carrier density, at the same time, lattice thermal conductivity can also be significantly reduced, to values near the glass limit of these materials, through combining filler species of different rattling frequencies to achieve broad-frequency phonon scattering. Therefore, partially filled skutterudites with multiple fillers of different chemical nature render unique structural characteristics for optimizing electrical and thermal transports in a relatively independent way, leading to continually enhanced ZT values from single- to double-, and finally to multiple-filled skutterudites. The idea of combining multiple fillers with different charge states and rattling frequencies for performance optimization is also expected to be valid for other caged TE compounds.
RESUMEN
Thermoelectric technology generates electricity from waste heat, but one bottleneck for wider use is the performance of thermoelectric materials. Manipulating the configurational entropy of a material by introducing different atomic species can tune phase composition and extend the performance optimization space. We enhanced the figure of merit (zT) value to 1.8 at 900 kelvin in an n-type PbSe-based high-entropy material formed by entropy-driven structural stabilization. The largely distorted lattices in this high-entropy system caused unusual shear strains, which provided strong phonon scattering to largely lower lattice thermal conductivity. The thermoelectric conversion efficiency was 12.3% at temperature difference ΔT = 507 kelvin, for the fabricated segmented module based on this n-type high-entropy material. Our demonstration provides a paradigm to improve thermoelectric performance for high-entropy thermoelectric materials through entropy engineering.
RESUMEN
Although the CoSb3-based skutterudite thermoelectric devices have been highly expected for wide uses such as waste heat recovery and space power supply, the limited long-term service stability majorly determined by the degradation of electrode interface obstructs its applications. Here, we built up an effective criterion for screening barrier layer based on the combination of negative interfacial reaction energy and high activation energy barrier of Sb migration through the formed interfacial reaction layer. Accordingly, we predicted niobium as a promising barrier layer. The experimental results show the skutterudite/Nb joint has the slowest interfacial reaction layer growth rate and smallest interfacial electrical resistivity. The fabricated 8-pair skutterudite module using Nb as barrier layer achieves a recorded conversion efficiency of 10.2% at hot-side temperature of 872 K and shows excellent stability during long-time aging. This simple criterion provides an effective guidance on screening barrier layer with bonding-blocking-conducting synergetic functions for thermoelectric device integration.
RESUMEN
Half-Heusler compounds are a class of promising thermoelectric (TE) materials for power generation. However, the large contact resistivity at the interface between TE legs and metal electrode of the TE device seriously hinders the full play of the material performance. Here we report an Ohmic contact for the junction of p-type Nb0.8Ti0.2FeSb and Mo electrode with a low contact resistivity of <1 µΩ cm2 due to the matching of work functions between Nb0.8Ti0.2FeSb and FeMo interlayer. The interface carrier transport is dominated by the field emission and consequently a strong tunneling electric current is obtained due to the high doping level and relatively low dielectric constant of p-type Nb0.8Ti0.2FeSb semiconductor. The interface microstructure analysis indicates that there is a FeMo alloy interlayer with a thickness of 5 µm and a mixing layer of Nb0.8Ti0.2FeSb and Nb3Ti with a thickness of 25 µm. After a long time heat treatment at 1073 K, the FeMo alloy transforms into a FeSb2 layer, while the mixing layer is occupied totally by Nb3Ti. Due to the relatively high electrical resistivity for FeSb2 phase, the increasing content of Nb3Ti and the crack at both sides of Nb3Ti interlayer, the contact resistivity rises up to 18.4 µΩ cm2 after 32 days' aging. These results demonstrate that the applicability of low contact resistivity NbFeSb/Mo junction in high performance TE devices.
RESUMEN
GeTe-based compounds have been intensively studied recently due to their superior thermoelectric performance, but their real applications are still limited so far due to the drastic volume variation that occurs during the rhombohedral-cubic phase transition, which may break the material or the material/electrode interface during service. Here, superior performance and high service stability for GeTe-based thermoelectric compounds are achieved by co-doping Mg and Sb into GeTe. The linear coefficient of thermal expansion before phase transition is greatly improved to match that after phase transition, yielding smooth volume variation around the phase transition temperature. Likewise, co-doping (Mg, Sb) in GeTe successfully tunes the carrier concentration to the optimal range and effectively suppresses the lattice thermal conductivity. A peak zT of 1.84 at 800 K and an average zT of 1.2 in 300-800 K have been achieved in Ge0.85Mg0.05Sb0.1Te. Finally, a Ni/Ti/Ge0.85Mg0.05Sb0.1Te thermoelectric uni-leg is fabricated and tested, showing quite good service stability even after 450 thermal cycles between 473 K and 800 K. This study will accelerate the application of GeTe-based compounds for power generation in the mid-temperature range.
RESUMEN
Recently, the electronegative elements (e.g., S, Se, Cl, and Br) filled skutterudites have attracted great attention in thermoelectric community. Via doping of some electron donors at the Sb sites, these electronegative elements can be filled into the voids of CoSb3 forming thermodynamically stable compounds, which greatly extends the scope of filled skutterudites. In this study, we show that doping appropriate elements at the Co sites can also stabilize the electronegative elements in the voids of CoSb3. A series of SyPdxCo4-xSb12 compounds were successfully fabricated by a traditional solid state reaction method combined with a spark plasma sintering technique. The phase composition and electrical and thermal transport properties were systematically characterized, and the related mechanisms were deeply discussed. It is found that the charge compensation between Pd doping and S filling is the main reason for the formation of thermodynamically stable SyPdxCo4-xSb12 compounds. Filling S element in the voids of CoSb3 provides additional holes to reduce the carrier concentration while scarcely affecting the carrier mobility. However, doping Pd at the Co sites not only changes the carrier scattering mechanism but also deteriorates the carrier mobility. Low lattice thermal conductivities are observed in these SyPdxCo4-xSb12 compounds, which are attributed to the low resonant frequency of the S element. Finally, a maximal figure of merit of 0.85 is obtained for S0.05Pd0.25Co3.75Sb12 at 700 K.
RESUMEN
Diamond-like compounds are a promising class of thermoelectric materials, very suitable for real applications. However, almost all high-performance diamond-like thermoelectric materials are p-type semiconductors. The lack of high-performance n-type diamond-like thermoelectric materials greatly restricts the fabrication of diamond-like material-based modules and their real applications. In this work, it is revealed that n-type AgInSe2 diamond-like compound has intrinsically high thermoelectric performance with a figure of merit (zT) of 1.1 at 900 K, comparable to the best p-type diamond-like thermoelectric materials reported before. Such high zT is mainly due to the ultralow lattice thermal conductivity, which is fundamentally limited by the low-frequency Ag-Se "cluster vibrations," as confirmed by ab initio lattice dynamic calculations. Doping Cd at Ag sites significantly improves the thermoelectric performance in the low and medium temperature ranges. By using such high-performance n-type AgInSe2-based compounds, the diamond-like thermoelectric module has been fabricated for the first time. An output power of 0.06 W under a temperature difference of 520 K between the two ends of the module is obtained. This work opens a new window for the applications using the diamond-like thermoelectric materials.
RESUMEN
Solid-state thermoelectric technology offers a promising solution for converting waste heat to useful electrical power. Both high operating temperature and high figure of merit zT are desirable for high-efficiency thermoelectric power generation. Here we report a high zT of â¼1.5 at 1,200 K for the p-type FeNbSb heavy-band half-Heusler alloys. High content of heavier Hf dopant simultaneously optimizes the electrical power factor and suppresses thermal conductivity. Both the enhanced point-defect and electron-phonon scatterings contribute to a significant reduction in the lattice thermal conductivity. An eight couple prototype thermoelectric module exhibits a high conversion efficiency of 6.2% and a high power density of 2.2 W cm(-2) at a temperature difference of 655 K. These findings highlight the optimization strategy for heavy-band thermoelectric materials and demonstrate a realistic prospect of high-temperature thermoelectric modules based on half-Heusler alloys with low cost, excellent mechanical robustness and stability.
RESUMEN
Iodine-doped Cu2 Se shows a significantly improved thermoelectric performance during phase transitions by electron and phonon critical scattering, leading to a dramatic increase in zT by a factor of 3-7 times culminating in zT values of 2.3 at 400 K.