Effects of different etching modes on the nanoleakage of universal adhesives: A systematic review and meta-analysis.

PURPOSE: The aim of this systematic review was to evaluate how etching modes affect the nanoleakage of universal adhesive from in vitro studies. MATERIALS AND METHODS: PubMed/MEDLINE, Web of Science, Scopus and Science Direct electronic databases were searched for in vitro studies that evaluated the nanoleakage of universal adhesives. A total of 511 (after duplicate removal) potentially relevant records were identified in the literature search. The titles and abstracts of the retrieved studies were screened by two independent researchers according to the main concept. Subsequently, the full text of potentially relevant studies was screened using the exclusion criteria. Thirteen studies were subjected to qualitative analysis, and 5 of them were selected for a detailed meta-analysis. RESULTS: Seven universal adhesives were evaluated in this review. The meta-analysis demonstrated that the etch-and-rinse technique significantly reduced the nanoleakage of the Peak Universal and G-Bond Plus adhesives, whereas the self-etch mode reduced the nanoleakage of All-Bond Universal. In comparison, the etching technique did not significantly alter the nanoleakage of either Prime&Bond Elect or Scotchbond Universal which was characterized by the smallest nanoleakage. CONCLUSIONS: Etching modes significantly, in various ways, influence the nanoleakage of universal adhesives. CLINICAL SIGNIFICANCE: Contrary to the drive to simplify bonding technologies, an appreciation of their adhesive components and how these perform according to bonding technique could yield a knowledge-based practical approach that ultimately improves the longevity of direct composite restorations.

Marginal integrity of flowable and packable bulk fill materials used for class II restorations -A systematic review and meta-analysis of in vitro studies.

This systematic review evaluates the marginal integrity of flowable and packable bulk fill composite materials placed in class II cavities. Electronic databases inclusive of MEDLINE, Scopus, and Web of Science were searched without restriction to date. The titles and abstracts of publications gathered from database searches were screened by reviewers according to the inclusion and exclusion criteria. From as initial yield of 142 articles ten studies were subject to qualitative analysis. The authors emphasized that marginal integrity in enamel and dentin does not significantly differ between flowable and packable bulk fill composites used for class II restorations. Moreover, their marginal integrity was comparable to conventional resin composites with incremental techniques. The adhesive system used with a total etch technique and assessed margin located in enamel resulted in better marginal integrity.

Risk factors in oroantral communication while extracting the upper third molar: Systematic review.

The removal of the upper third molar is a procedure commonly performed in oral and maxillofacial surgery. Maxillary third molars are generally less difficult to extract than mandibular third molars. The surgical removal of maxillary third molars is usually associated with low complication rates and low morbidity. This procedure involves the risk of developing complications such as oroantral communication, displacement into adjacent anatomic spaces, fracture of the maxillary tuberosity, and root fracture. Orthopantomograms are the standard preoperative imaging modality, but there is no proven tool for predicting oroantral communication. New possibilities have been offered by cone-beam computed tomography, which is increasingly used in dentistry and is an innovative technique that provides more information as it eliminates the superimposition of surrounding structures and allows the acquisition of 3-dimensional images and their qualitative assessment. The aim of this systematic review was to assess risk factors during the extraction of the upper third molar using orthopantomograms and cone-beam computed tomography.