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1.
BMC Musculoskelet Disord ; 20(1): 213, 2019 May 15.
Artigo em Inglês | MEDLINE | ID: mdl-31092237

RESUMO

BACKGROUND: An interspinous process device, the Device for Intervertebral Assisted Motion (DIAM™) designed to treat lumbar neurogenic disease secondary to the lumbar spinal stenosis, it provides dynamic stabilization after minimally invasive (MI) lumbar decompression. The current study was conducted using an experimentally validated L1-L5 spinal finite element model (FEM) to evaluate the limited decompression on range of motion (ROM) and stress distribution on a neural arch implanted with the DIAM. METHODS: The study simulated bilateral laminotomies with partial discectomy at L3-L4, as well as unilateral and bilateral laminotomies with partial discectomy combined with implementation of the DIAM at L3-L4. The ROM and maximum von Mises stresses in flexion, extension, lateral bending, and axial torsion were analyzed in response to the hybrid protocol in comparison with the intact model. RESULTS: The investigation revealed that decreased ROM, intradiscal stress, and facet joint force at the implant level, but considerably increased stress at the pars interarticularis were found during flexion and torsion at the L4, as well as during extension, lateral bending, and torsion at the L3, when the DIAM was implanted compared with the defect model. CONCLUSION: The results demonstrate that the DIAM may be beneficial in reducing the symptoms of stress-induced low back pain. Nevertheless, the results also suggest that a surgeon should be cognizant of the stress redistribution at the pars interarticularis results from MI decompression plus the application of the interspinous process device.


Assuntos
Vértebras Lombares/cirurgia , Modelos Biológicos , Próteses e Implantes , Implantação de Prótese/métodos , Estenose Espinal/cirurgia , Discotomia/instrumentação , Discotomia/métodos , Estudos de Viabilidade , Análise de Elementos Finitos , Humanos , Disco Intervertebral/fisiologia , Disco Intervertebral/cirurgia , Laminectomia/instrumentação , Laminectomia/métodos , Vértebras Lombares/fisiologia , Implantação de Prótese/instrumentação , Amplitude de Movimento Articular/fisiologia , Estresse Mecânico
2.
PLoS One ; 15(12): e0244571, 2020.
Artigo em Inglês | MEDLINE | ID: mdl-33378405

RESUMO

Recently, various designs and material manufactured interspinous process devices (IPDs) are on the market in managing symptomatic lumbar spinal stenosis (LSS). However, atraumatic fracture of the intervening spinous process has been reported in patients, particularly, double or multiple level lumbar decompression surgery with IPDs. This study aimed to biomechanically investigate the effects of few commercial IPDs, namely DIAMTM, CoflexTM, and M-PEEK, which were implanted into the L2-3, L3-4 double-level lumbar spinal processes. A validated finite element model of musculoskeletal intact lumbar spinal column was modified to accommodate the numerical analysis of different implants. The range of motion (ROM) between each vertebra, stiffness of the implanted level, intra stress on the intervertebral discs and facet joints, and the contact forces on spinous processes were compared. Among the three implants, the Coflex system showed the largest ROM restriction in extension and caused the highest stress over the disc annulus at the adjacent levels, as well as the sandwich phenomenon on the spinous process at the instrumented levels. Further, the DIAM device provided a superior loading-sharing between the two bridge supports, and the M-PEEK system offered a superior load-sharing from the superior spinous process to the lower pedicle screw. The limited motion at the instrumented segments were compensated by the upper and lower adjacent functional units, however, this increasing ROM and stress would accelerate the degeneration of un-instrumented segments.


Assuntos
Descompressão Cirúrgica/instrumentação , Vértebras Lombares/cirurgia , Estenose Espinal/cirurgia , Fenômenos Biomecânicos , Análise de Elementos Finitos , Humanos , Vértebras Lombares/fisiopatologia , Amplitude de Movimento Articular , Estenose Espinal/fisiopatologia
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