RESUMO
Rashba spin-orbit coupling (SOC) could facilitate an efficient interconversion between spin and charge currents. Among various systems, BiTeI holds one of the largest Rashba-type spin splittings. Unlike other Rashba systems (e.g., Bi/Ag and Bi2Se3), an experimental investigation of the spin-to-charge interconversion in BiTeI remains to be explored. Through performing an angle-resolved photoemission spectroscopy (ARPES) measurement, such a large Rashba-type spin splitting with a Rashba parameter αR = 3.68 eV Å is directly identified. By studying the spin pumping effect in the BiTeI/NiFe bilayer, we reveal a very large inverse Rashba-Edelstein length λIREE ≈ 1.92 nm of BiTeI at room temperature. Furthermore, the λIREE monotonously increases to 5.00 nm at 60 K, indicating an enhanced Rashba SOC at low temperature. These results suggest that BiTeI films with the giant Rashba SOC are promising for achieving efficient spin-to-charge interconversion, which could be implemented for building low-power-consumption spin-orbitronic devices.
RESUMO
In this work, thin reduced graphene oxide (GO) composite films were fabricated for electromagnetic interference (EMI) shielding application. High solid content GO slurry (7 wt %) was obtained by dispersing GO clay in polymer solution under high-speed mechanical stirring. A composite film with varied thickness (10-150 µm) could be fabricated in pilot scale. After an optimized thermal annealing procedure, the final product showed good conductivity, which reached 500 S·cm-1. The thin sample (thickness < 0.1 mm) containing 10% polymer showed an enhanced EMI shielding performance of 55-65 dB. The outstanding EMI shielding efficiency as well as good suppleness and industrialized potential of thermal reduced graphene oxide polymer composite films could make a progress on their application in flexible devices as an EMI shielding material.
RESUMO
In this work, a large-scale preparation of graphene oxide (GO) film is reported, and the structure and the compositional variation was studied after thermal annealing. The electromagnetic interference (EMI) shielding performance of thermally reduced GO films was also investigated. Commercial GO clay was well dispersed by high-speed shearing and formed a stable slurry with a high solid content in water (5%), and this was chosen rather than organic solvent due to its optimal performance in coating procedures and film quality. The optimized thermal annealing procedure resulted in a significant enhancement of electric conductivity and EMI shielding efficiency, which reached 500 S cm-1 and 32-42 dB with the thickness under 0.1 mm. The excellent EMI shielding efficiency of thermally reduced GO film, as well as the easily amplified pilot manufactoring procedure adaptive to commercial equipment, produce graphene for universal EMI shielding materials.