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The in situ free carbon generated in polymer-derived ceramics (PDCs) plays a crucial role in their unique microstructure and resultant properties. This study advances a new phenomenon of graphitization of PDCs. Specifically, whether in micro-/nanoscale films or millimeter-scale bulks, the surface/interface radically changes the fate of carbon and the evolution of PDC nanodomains, promotes the graphitization of carbon, and evolves a free carbon enriched layer in the near-surface/interface region. Affected by the enrichment behavior of free carbon in the near-surface/interface region, PDCs exhibit highly abnormal properties such as the skin behavior and edge effect of the current. The current intensity in the near-surface/interface region of PDCs is orders of magnitude higher than that in its interior. Ultrahigh conductivity of up to 14.47 S cm-1 is obtained under the action of the interface and surface, which is 5-8 orders of magnitude higher than that of the bulk prepared under the same conditions. Such surface/interface interactions are of interest for the regulation of free carbon and its resultant properties, which are the core of PDC applications. Finally, the first PDC thin-film strain gauge that can survive a butane flame with a high temperature of up to ≈1300 °C is fabricated.
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Monitoring high-temperature strain on curved components in harsh environments is a challenge for a wide range of applications, including in aircraft engines, gas turbines, and hypersonic vehicles. Although there are significant improvements in the preparation of high-temperature piezoresistive film on planar surfaces using 3D printing methods, there are still difficulties with poor surface compatibility and high-temperature strain testing on curved surfaces. Herein, a conformal direct ink writing (CDIW) system coupled with an error feedback regulation strategy was used to fabricate high-precision, thick films on curved surfaces. This strategy enabled the maximum amount of error in the distance between the needle and the substrate on a curved surface to be regulated from 155 to 4 µm. A conformal Pt thick-film strain gauge (CPTFSG) with a room-temperature strain coefficient of 1.7 was created on a curved metallic substrate for the first time. The resistance drift rate at 800 °C for 1 h was 1.1%, which demonstrated the excellent stability and oxidation resistance of the CPTFSG. High-temperature dynamic strain tests up to 769 °C revealed that the sensor had excellent high-temperature strain test performance. Furthermore, the CPTFSG was conformally deposited on an aero-engine turbine blade to perform in situ tensile and compressive strain testing at room temperature. High-temperature strain tests were conducted at 100 and 200 °C for 600 and 580 µÎµ, respectively, demonstrating a high steady-state response consistent with the commercial high-temperature strain transducer. In addition, steady-state strain tests at high temperatures up to 496 °C were tested. The CDIW error modulation strategy provides a highly promising approach for the high-precision fabrication of Pt thick films on complex surfaces and driving in situ sensing of high-temperature parameters on curved components toward practical applications.
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Thin-film sensors are essential for real-time monitoring of components in high-temperature environments. Traditional fabrication methods often involve complicated fabrication steps or require prolonged high-temperature annealing, limiting their practical applicability. Here, we present an approach using direct ink writing and laser scanning (DIW-LS) to fabricate high-temperature functional thin films. An indium tin oxide (ITO)/preceramic polymer (PP) ink suitable for DIW was developed. Under LS, the ITO/PP thin film shrank in volume. Meanwhile, the rapid pyrolysis of PP into amorphous precursor-derived ceramic (PDC) facilitated the faster sintering of ITO nanoparticles and improved the densification of the thin film. This process realized the formation of a conductive network of interconnected ITO nanoparticles. The results show that the ITO/PDC thin film exhibits excellent stability, with a drift rate of 4.7 % at 1000 °C for 25 h, and withstands temperatures up to 1250 °C in the ambient atmosphere. It is also sensitive to strain, with a maximum gauge factor of -6.0. As a proof of concept, we have used DIW-LS technology to fabricate a thin-film heat flux sensor on the surface of the turbine blade, capable of measuring heat flux densities over 1 MW/m2. This DIW-LS process provides a viable approach for the integrated, rapid, and flexible fabrication of thin film sensors for harsh environments.
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In situ temperature monitoring of curved high-temperature components in extreme environments is challenging for a variety of applications in fields such as aero engines and gas turbines. Recently, extrusion-based direct ink writing (DIW) has been utilized to fabricate platinum (Pt) resistance temperature detectors (RTDs). However, the current Pt RTD prepared by DIW technology suffers from a limited temperature range and poor high-temperature stability. Here, DIW technology and yttria-stabilized zirconia (YSZ)-modified precursor ceramic film packaging have been used to build a Pt RTD with high-temperature resistance, small disturbance, and high stability. The results indicate that the protective layer formed by the liquid phase anchors the Pt particles and reduces the agglomeration and volatilization of the Pt sensitive layer at high temperature. Attributed to the SiCN/YSZ protective layer, the temperature resistance curve of the Pt RTD in the range of 50-800 °C has little deviation from the fitting curve, and the fitting correlation coefficient is above 0.9999. Interestingly, the Pt RTD also has high repeatability and stability. The high temperature resistance drift rate is only 0.05%/h after 100 h of long-term testing at 800 °C and can withstand butane flame up to â¼1300 °C without damage. Moreover, the Pt RTD can be conformally deposited on the outer ring of aerospace bearings by DIW technology and then realize on-site, nondestructive, and real-time monitoring of bearing temperature. The fabricated Pt RTD shows great potential for high-temperature applications, and the novel technology proposed provides a feasible pathway for temperature monitoring of aeroengine internal curved hot-end components.
RESUMO
Polymer-derived ceramic (PDC)-based high-temperature thin-film sensors (HTTFSs) exhibit promising applications in the condition monitoring of critical components in aerospace. However, fabricating PDC-based HTTFS integrated with high-efficiency, high-temperature anti-oxidation, and customized patterns remains challenging. In this work, we introduce a rapid and flexible selecting laser pyrolysis combined with a direct ink writing process to print double-layer high-temperature antioxidant PDC composite thin-film thermistors under ambient conditions. The sensitive layer (SL) was directly written on an insulating substrate with excellent conductivity by laser-induced graphitization. Then, the antioxidant layer (AOL) was written on the surface of the SL to realize the integrated manufacturing of double-functional layers. Through characterization analysis, it was shown that B2O3 and SiO2 glass phases generated by the PDC composite AOL could effectively prevent oxygen intrusion. Therefore, the fabricated PDC composite thermistors exhibited a negative temperature coefficient in the temperature range from 100 to 1100 °C and high repeatability below 800 °C. Meanwhile, it has excellent high-temperature stability at 800 °C with a resistance change of only 2.4% in 2 h. Furthermore, the high-temperature electrical behavior of the thermistor was analyzed. The temperature dependence of the conductivity for this thermistor has shown an agreement with the Mott's variable range hopping mechanism. Additionally, the thermistor was fabricated on the surface of an aero-engine blade to verify its feasibility below 800 °C, showing the great potential of this work for state sensing on the surface of high-temperature components, especially for customized requirements.
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A high-temperature thin/thick-film strain gauge (TFSG) shows development prospects for in situ strain monitoring of hot-end components due to their small perturbations, no damage, and fast response. Direct ink writing (DIW) 3D printing is an emerging and facile approach for the rapid fabrication of TFSG. However, TFSGs prepared based on 3D printing with both high thermal stability and low temperature coefficient of resistance (TCR) over a wide temperature range remain a great challenge. Here, we report a AgPd TFSG with a glass-ceramic protective layer based on DIW. By encapsulating the AgPd sensitive layer and regulating the Pd content, the AgPd TFSG demonstrated a low TCR (191.6 ppm/°C) from 50 to 800 °C and ultrahigh stability (with a resistance drift rate of 0.14%/h at 800 °C). Meanwhile, the achieved specifications for strain detection included a strain sensing range of ±500 µÎµ, fast response time of 153 ms, gauge factor of 0.75 at 800 °C, and high durability of >8000 cyclic loading tests. The AgPd TFSG effectively monitors strain in superalloys and can be directly deposited onto cylindrical surfaces, demonstrating the scalability of the presented approach. This work provides a strategy to develop TFSGs for in situ sensing of complex curved surfaces in harsh environments.
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The in-situ strain/stress detection of hot components in harsh environments remains a challenging task. In this study, ZrB2/SiCN thin-film strain gauges were fabricated on alumina substrates by direct writing. The effects of ZrB2 content on the electrical conductivity and strain sensitivity of ZrB2/SiCN composites were investigated, and based on these, thin film strain gauges with high electrical conductivity (1.71 S/cm) and a gauge factor of 4.8 were prepared. ZrB2/SiCN thin-film strain gauges exhibit excellent static, cyclic strain responses and resistance stability at room temperature. In order to verify the high temperature performance of the ZrB2/SiCN thin-film strain gauges, the temperature-resistance characteristic curves test, high temperature resistance stability test and cyclic strain test were conducted from 25 °C to 600 °C. ZrB2/SiCN thin-film strain gauges exhibit good resistance repeatability and stability, and highly sensitive strain response, from 25 °C to 600 °C. Therefore, ZrB2/SiCN thin-film strain gauges provide an effective approach for the measurement of in-situ strain of hot components in harsh environments.
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This paper investigates the feasibility and performance of the fabrication of platinum high-temperature thin-film strain sensors on nickel-based alloy substrates by additive manufacturing. The insulating layer was made of a dielectric paste by screen printing process. A 1.8-micron-thick platinum film was deposited directly on the insulating layer. The four-wire resistance measurement method was used to eliminate the contact resistance of the solder joints. Comprehensive morphological and electrical characterization of the platinum thin-film strain gauge was carried out, and good static and dynamic strain responses were obtained, which confirmed that the strain gauge was suitable for in situ strain monitoring of high-temperature complex components.
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A reliable protective layer is one of the main challenges in preventing oxidation of thin film sensors to achieve accurate, effective, and stable readings at high temperatures. In this work, an Al2O3-modified polymer-derived ceramic SiCN composite coating fabricated by a direct-writing technique is utilized as a protective layer for thin film sensors. The microstructure evolution of the Al2O3/SiCN films is examined herein. The protective layer exhibits excellent oxidation resistance and thermal stability at high temperatures up to 1000 °C, which contributes to improving the stability and lifetime of thin film sensors in extreme environments. The TiB2/SiCN thin film resistive grid with the Al2O3/SiCN composite film as a protective layer is fabricated and tested. The results indicate that the coating can protect the TiB2/SiCN thin film resistive grid at high temperatures up to 1000 °C, which is about 200 °C higher than that of the TiB2/SiCN thin film resistive grid without a protective layer. The resistance change rates of the TiB2/SiCN thin film resistive grid with a protective layer are 0.5%/h at 900 °C and 10.7%/h at 1000 °C.
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Carbon-rich SiCN ceramics were prepared by divinylbenzene (DVB)-modified polysilazane (PSN2), and a high-conductivity SiCN thin film sensor suitable for medium-low temperature sensing was fabricated. The modified liquid precursors were patterned by direct ink writing to produce SiCN resistive grids with line widths of several hundreds of micrometers and thicknesses of several micrometers. The introduction of DVB not only increases the critical thickness of SiCN ceramics several times, but also significantly improves the conductivity of SiCN, making it meet the conductivity requirements of sensing applications in the mid-low temperature range. The electrical conductivity and microstructure of DVB-modified SiCN ceramics were studied in detail. In the temperature range of 30~400 °C, the temperature resistance performance of DVB modified SiCN resistance grid was measured. The SiCN ceramics with low DVB content not only have excellent electrical conductivity, but also have good oxidation resistance.