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Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes.
Haider, Imran; Gul, Iftikhar Hussain; Umer, Malik Adeel; Baig, Mutawara Mahmood.
Affiliation
  • Haider I; Thermal Transport Laboratory, Department of Materials Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Islamabad 44000, Pakistan.
  • Gul IH; Thermal Transport Laboratory, Department of Materials Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Islamabad 44000, Pakistan.
  • Umer MA; Thermal Transport Laboratory, Department of Materials Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Islamabad 44000, Pakistan.
  • Baig MM; Thermal Transport Laboratory, Department of Materials Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Islamabad 44000, Pakistan.
Materials (Basel) ; 16(5)2023 Feb 22.
Article in En | MEDLINE | ID: mdl-36902904
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2023 Type: Article Affiliation country: Pakistan
Fulltext
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PubMed Links
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2023 Type: Article Affiliation country: Pakistan