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High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano-Thermal Interface Material.
Loeblein, Manuela; Tsang, Siu Hon; Pawlik, Matthieu; Phua, Eric Jian Rong; Yong, Han; Zhang, Xiao Wu; Gan, Chee Lip; Teo, Edwin Hang Tong.
Afiliación
  • Loeblein M; CNRS-International NTU Thales Research Alliance (CINTRA) UMI 3288 , Research Techno Plaza, 50 Nanyang Drive, Singapore 637553, Singapore.
  • Tsang SH; Institute of Microelectronics, Agency for Science, Technology and Research (A*Star) , 11 Science Park Road, Singapore 117685, Singapore.
  • Pawlik M; Temasek Laboratories@NTU , 50 Nanyang Avenue, Singapore 639798, Singapore.
  • Phua EJ; CNRS-International NTU Thales Research Alliance (CINTRA) UMI 3288 , Research Techno Plaza, 50 Nanyang Drive, Singapore 637553, Singapore.
  • Yong H; Temasek Laboratories@NTU , 50 Nanyang Avenue, Singapore 639798, Singapore.
  • Zhang XW; Institute of Microelectronics, Agency for Science, Technology and Research (A*Star) , 11 Science Park Road, Singapore 117685, Singapore.
  • Gan CL; Institute of Microelectronics, Agency for Science, Technology and Research (A*Star) , 11 Science Park Road, Singapore 117685, Singapore.
  • Teo EH; Temasek Laboratories@NTU , 50 Nanyang Avenue, Singapore 639798, Singapore.
ACS Nano ; 11(2): 2033-2044, 2017 02 28.
Article en En | MEDLINE | ID: mdl-28157329
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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: ACS Nano Año: 2017 Tipo del documento: Article País de afiliación: Singapur
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: ACS Nano Año: 2017 Tipo del documento: Article País de afiliación: Singapur