Your browser doesn't support javascript.
loading
Characterizations of Rapid Sintered Nanosilver Joint for Attaching Power Chips.
Feng, Shuang-Tao; Mei, Yun-Hui; Chen, Gang; Li, Xin; Lu, Guo-Quan.
Afiliación
  • Feng ST; Key Laboratory of Advanced Ceramics and Machining Technology of Ministry of Education, Tianjin University, 135# Yaguan Road, Jinnan District, Tianjin 300350, China. 13207567335@163.com.
  • Mei YH; Tianjin Key Laboratory of Advanced Joining Technology and School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China. 13207567335@163.com.
  • Chen G; Key Laboratory of Advanced Ceramics and Machining Technology of Ministry of Education, Tianjin University, 135# Yaguan Road, Jinnan District, Tianjin 300350, China. yunhui@tju.edu.cn.
  • Li X; Tianjin Key Laboratory of Advanced Joining Technology and School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China. yunhui@tju.edu.cn.
  • Lu GQ; School of Chemical Engineering and Technology, Tianjin University, Tianjin 300350, China. agang@tju.edu.cn.
Materials (Basel) ; 9(7)2016 Jul 12.
Article en En | MEDLINE | ID: mdl-28773686
Palabras clave
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2016 Tipo del documento: Article País de afiliación: China
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2016 Tipo del documento: Article País de afiliación: China