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Freestanding 3D Mesostructures, Functional Devices, and Shape-Programmable Systems Based on Mechanically Induced Assembly with Shape Memory Polymers.
Wang, Xueju; Guo, Xiaogang; Ye, Jilong; Zheng, Ning; Kohli, Punit; Choi, Dongwhi; Zhang, Yi; Xie, Zhaoqian; Zhang, Qihui; Luan, Haiwen; Nan, Kewang; Kim, Bong Hoon; Xu, Yameng; Shan, Xiwei; Bai, Wubin; Sun, Rujie; Wang, Zizheng; Jang, Hokyung; Zhang, Fan; Ma, Yinji; Xu, Zheng; Feng, Xue; Xie, Tao; Huang, Yonggang; Zhang, Yihui; Rogers, John A.
Afiliación
  • Wang X; Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.
  • Guo X; Department of Mechanical and Aerospace Engineering, University of Missouri-Columbia, Columbia, MO, 65211, USA.
  • Ye J; Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China.
  • Zheng N; Center for Nano and Micro Mechanics, Tsinghua University, Beijing, 100084, P. R. China.
  • Kohli P; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, P. R. China.
  • Choi D; Department of Chemistry and Biochemistry, Southern Illinois University, Carbondale, IL, 62901, USA.
  • Zhang Y; Department of Mechanical Engineering, Kyung Hee University, Yongin, 17104, South Korea.
  • Xie Z; Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.
  • Zhang Q; Department of Biomedical, Biological and Chemical Engineering, University of Missouri-Columbia, Columbia, MO, 65211, USA.
  • Luan H; Departments of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Nan K; Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.
  • Kim BH; Departments of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Xu Y; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.
  • Shan X; Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.
  • Bai W; Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.
  • Sun R; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.
  • Wang Z; Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.
  • Jang H; Bristol Composites Institute (ACCIS), University of Bristol, Bristol, BS8 1TR, UK.
  • Zhang F; Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA.
  • Ma Y; Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA.
  • Xu Z; Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China.
  • Feng X; Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China.
  • Xie T; Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China.
  • Huang Y; The State Key Laboratory for Manufacturing and Systems Engineering, School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
  • Zhang Y; Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China.
  • Rogers JA; State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, P. R. China.
Adv Mater ; 31(2): e1805615, 2019 Jan.
Article en En | MEDLINE | ID: mdl-30370605
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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2019 Tipo del documento: Article País de afiliación: Estados Unidos
Texto completo
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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Revista: Adv Mater Asunto de la revista: BIOFISICA / QUIMICA Año: 2019 Tipo del documento: Article País de afiliación: Estados Unidos