Increasing the accuracy of 3D EEG implantations.
J Neurosurg
; : 1-8, 2019 May 17.
Article
en En
| MEDLINE
| ID: mdl-31100733
ABSTRACT
OBJECTIVEThe accuracy of stereoelectroencephalography (SEEG) electrode implantation is an important factor in maximizing its safety. The authors established a quality assurance (QA) process to aid advances in implantation accuracy.METHODSThe accuracy of three consecutive modifications of a frameless implantation technique was quantified in three cohorts comprising 22, 8, and 23 consecutive patients. The modifications of the technique aimed to increase accuracy of the bolt placement.RESULTSThe lateral shift of the axis of the implanted bolt at the level of the planned entry point was reduced from a mean of 3.0 ± 1.6 mm to 1.4 ± 0.8 mm. The lateral shift of the axis of the implanted bolt at the level of the planned target point was reduced from a mean of 3.8 ± 2.5 mm to 1.6 ± 0.9 mm.CONCLUSIONSThis QA framework helped to isolate and quantify the factors introducing inaccuracy in SEEG implantation, and to monitor ongoing accuracy and the effect of technique modifications.
EP = entry point; IQR = interquartile range; M1, M2, M3 = method 1, method 2, method 3; NHNN = National Hospital for Neurology and Neurosurgery; QA = quality assurance; SEEG; SEEG = stereoelectroencephalography; TP = target point; accuracy; epilepsy; iEP = implemented EP; iTP = distal contact of the implanted electrode; implantation; pTP = planned TP; quality assurance
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Colección:
01-internacional
Banco de datos:
MEDLINE
Idioma:
En
Revista:
J Neurosurg
Año:
2019
Tipo del documento:
Article