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A Multi-Method Simulation Toolbox to Study Performance and Variability of Nanowire FETs.
Seoane, Natalia; Nagy, Daniel; Indalecio, Guillermo; Espiñeira, Gabriel; Kalna, Karol; García-Loureiro, Antonio.
Afiliación
  • Seoane N; Centro Singular de Investigación en Tecnoloxías da Información, University of Santiago de Compostela, 15782 Santiago de Compostela, Spain. natalia.seoane@usc.es.
  • Nagy D; Centro Singular de Investigación en Tecnoloxías da Información, University of Santiago de Compostela, 15782 Santiago de Compostela, Spain.
  • Indalecio G; Centro Singular de Investigación en Tecnoloxías da Información, University of Santiago de Compostela, 15782 Santiago de Compostela, Spain.
  • Espiñeira G; Centro Singular de Investigación en Tecnoloxías da Información, University of Santiago de Compostela, 15782 Santiago de Compostela, Spain.
  • Kalna K; Nanoelectronic Devices Computational Group, College of Engineering, Swansea University, Swansea, Wales SA1 8EN, UK.
  • García-Loureiro A; Centro Singular de Investigación en Tecnoloxías da Información, University of Santiago de Compostela, 15782 Santiago de Compostela, Spain.
Materials (Basel) ; 12(15)2019 Jul 26.
Article en En | MEDLINE | ID: mdl-31357496
ABSTRACT
An in-house-built three-dimensional multi-method semi-classical/classical toolbox has been developed to characterise the performance, scalability, and variability of state-of-the-art semiconductor devices. To demonstrate capabilities of the toolbox, a 10 nm gate length Si gate-all-around field-effect transistor is selected as a benchmark device. The device exhibits an off-current (I OFF) of 0 . 03 µA/µm, and an on-current (I ON) of 1770 µA/µm, with the I ON / I OFF ratio 6 . 63 × 10 4, a value 27 % larger than that of a 10 . 7 nm gate length Si FinFET. The device SS is 71 mV/dec, no far from the ideal limit of 60 mV/dec. The threshold voltage standard deviation due to statistical combination of four sources of variability (line- and gate-edge roughness, metal grain granularity, and random dopants) is 55 . 5 mV, a value noticeably larger than that of the equivalent FinFET (30 mV). Finally, using a fluctuation sensitivity map, we establish which regions of the device are the most sensitive to the line-edge roughness and the metal grain granularity variability effects. The on-current of the device is strongly affected by any line-edge roughness taking place near the source-gate junction or by metal grains localised between the middle of the gate and the proximity of the gate-source junction.
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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2019 Tipo del documento: Article País de afiliación: España

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Materials (Basel) Año: 2019 Tipo del documento: Article País de afiliación: España