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IoT device fabrication using roll-to-roll printing process.
Phung, Thanh Huy; Gafurov, Anton Nailevich; Kim, Inyoung; Kim, Sung Yong; Kim, Kyoung Min; Lee, Taik-Min.
Afiliación
  • Phung TH; Department of Printed Electronics, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon, 34103, Republic of Korea.
  • Gafurov AN; Department of Printed Electronics, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon, 34103, Republic of Korea.
  • Kim I; Department of Nanomechatronics, Korea University of Science and Technology (UST), 217 Gajeong-ro, Yuseong-gu, Daejeon, 34113, Republic of Korea.
  • Kim SY; Department of Printed Electronics, Korea Institute of Machinery and Materials (KIMM), 156 Gajeongbuk-Ro, Yuseong-Gu, Daejeon, 34103, Republic of Korea. ikim@kimm.re.kr.
  • Kim KM; Department of Nanomechatronics, Korea University of Science and Technology (UST), 217 Gajeong-ro, Yuseong-gu, Daejeon, 34113, Republic of Korea. ikim@kimm.re.kr.
  • Lee TM; Department of Electronics Engineering, Korea Polytechnic University, 237 Sangidaehak-ro, Siheung-Si, Gyeonggi-Do, 15073, Republic of Korea.
Sci Rep ; 11(1): 19982, 2021 Oct 07.
Article en En | MEDLINE | ID: mdl-34620970
ABSTRACT
With the development of technology, wireless and IoT devices are increasingly used from daily life to industry, placing demands on rapid and efficient manufacturing processes. This study demonstrates the fabrication of an IoT device using a roll-to-roll printing process, which could shorten the device fabrication time and reduce the cost of mass production. Here, the fabricated IoT device is designed to acquire data through the sensor, process the data, and communicate with end-user devices via Bluetooth communication. For fabrication, a four-layer circuit platform consisting of two conductive layers, an insulating layer including through holes, and a solder resist layer is directly printed using a roll-to-roll screen printing method. After the printing of the circuit platform, an additional layer of solder paste is printed to assemble the electrical components into the device, inspiring the fully roll-to-roll process for device fabrication. Successful IoT device deployment opens the chance to broaden the roll-to-roll fabrication process to other flexible and multilayer electronic applications.

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Sci Rep Año: 2021 Tipo del documento: Article

Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Sci Rep Año: 2021 Tipo del documento: Article