High Interfacial Thermal Stability of Flexible Flake-Structured Aluminum Thin-Film Electrodes for Bi<sub>2</sub>Te<sub>3</sub>-Based Thermoelectric Devices.

Wang, Yaling; Zhu, Pengcheng; Li, Wenqiang; Liu, Xiaobiao; Li, Hui; Deng, Yuan; Tan, Ming

High Interfacial Thermal Stability of Flexible Flake-Structured Aluminum Thin-Film Electrodes for Bi₂Te₃-Based Thermoelectric Devices.

Wang, Yaling; Zhu, Pengcheng; Li, Wenqiang; Liu, Xiaobiao; Li, Hui; Deng, Yuan; Tan, Ming.

Afiliación

Wang Y; College of Science, Henan Agricultural University, Zhengzhou 450002, China.
Zhu P; Key Laboratory of Materials Physics, Ministry of Education, School of Physics and Microelectronics, Zhengzhou University, Zhengzhou 450001, China.
Li W; College of Science, Henan Agricultural University, Zhengzhou 450002, China.
Liu X; College of Science, Henan Agricultural University, Zhengzhou 450002, China.
Li H; College of Science, Henan Agricultural University, Zhengzhou 450002, China.
Deng Y; Hangzhou Innovation Institute, Beihang University, Hangzhou 310052, China.
Tan M; Research Institute for Frontier Science, Beihang University, Beijing 100083, China.

ACS Appl Mater Interfaces ; 14(10): 12920-12926, 2022 Mar 16.

Article en En | MEDLINE | ID: mdl-35239312

Palabras clave

Al thin film; flake structure; flexibility; thermal stability; thermoelectric device

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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Asunto de la revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Año: 2022 Tipo del documento: Article País de afiliación: China

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