Extracting and Analyzing the S-Parameters of Vertical Interconnection Structures in 3D Glass Packaging.

Liu, Jinxu; Zhang, Jihua; Gao, Libin; Chen, Hongwei

Liu, Jinxu; Zhang, Jihua; Gao, Libin; Chen, Hongwei.

Afiliación

Liu J; School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China.
Zhang J; State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China.
Gao L; School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China.
Chen H; State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China.

Micromachines (Basel) ; 14(4)2023 Mar 31.

Article en En | MEDLINE | ID: mdl-37421035

Palabras clave

3D glass packaging; through-glass vias (TGVs); transmission matrix (T-matrix); vertical interconnection

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Texto completo: 1 Colección: 01-internacional Banco de datos: MEDLINE Idioma: En Revista: Micromachines (Basel) Año: 2023 Tipo del documento: Article País de afiliación: China

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