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A New Memristor with 2D Ti3 C2 Tx MXene Flakes as an Artificial Bio-Synapse.
Yan, Xiaobing; Wang, Kaiyang; Zhao, Jianhui; Zhou, Zhenyu; Wang, Hong; Wang, Jingjuan; Zhang, Lei; Li, Xiaoyan; Xiao, Zuoao; Zhao, Qianlong; Pei, Yifei; Wang, Gong; Qin, Cuiya; Li, Hui; Lou, Jianzhong; Liu, Qi; Zhou, Peng.
Afiliação
  • Yan X; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Wang K; Department of Materials Science and Engineering, National University of Singapore, Singapore, 117576, Singapore.
  • Zhao J; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Zhou Z; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Wang H; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Wang J; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Zhang L; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Li X; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Xiao Z; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Zhao Q; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Pei Y; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Wang G; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Qin C; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Li H; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Lou J; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Liu Q; Research Center of Machine Vision Engineering of Hebei University, Key Laboratory of Digital Medical Engineering of Hebei Province, College of Electron and Information Engineering, Hebei University, Baoding, 071002, P. R. China.
  • Zhou P; Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, P. R. China.
Small ; 15(25): e1900107, 2019 06.
Article em En | MEDLINE | ID: mdl-31066210
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2019 Tipo de documento: Article
Texto completo
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PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2019 Tipo de documento: Article