Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging.

Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; Gao, Runhua; Nishikawa, Hiroshi

Suppressed Growth of (Fe, Cr_, Co_, Ni_, Cu)Sn₂ Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu_0.5 Substrate during Solid-state Aging.

Shen, Yu-An; Lin, Chun-Ming; Li, Jiahui; Gao, Runhua; Nishikawa, Hiroshi.

Afiliação

Shen YA; Joining and Welding Research Institute (JWRI), Osaka University, Osaka, 5600047, Japan. yashen@jwri.osaka-u.ac.jp.
Lin CM; Department of Mechanical Engineering, Minghsin University of Science and Technology, Hsinchu, 30401, Taiwan, Republic of China.
Li J; Department of Aviation Mechanical Engineering, China University of Science and Technology, Hsinchu, 312, Taiwan, Republic of China.
Gao R; Joining and Welding Research Institute (JWRI), Osaka University, Osaka, 5600047, Japan.
Nishikawa H; Graduate School of Engineering, Osaka University, Osaka, Japan.

Sci Rep ; 9(1): 10210, 2019 Jul 15.

Article em En | MEDLINE | ID: mdl-31308462

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Rep Ano de publicação: 2019 Tipo de documento: Article País de afiliação: Japão

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