Toward Optimal Heat Transfer of 2D-3D Heterostructures <i>via</i> van der Waals Binding Effects.

Zhang, Lenan; Zhong, Yang; Qian, Xin; Song, Qichen; Zhou, Jiawei; Li, Long; Guo, Liang; Chen, Gang; Wang, Evelyn N

Toward Optimal Heat Transfer of 2D-3D Heterostructures via van der Waals Binding Effects.

Zhang, Lenan; Zhong, Yang; Qian, Xin; Song, Qichen; Zhou, Jiawei; Li, Long; Guo, Liang; Chen, Gang; Wang, Evelyn N.

Afiliação

Zhang L; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Zhong Y; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Qian X; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Song Q; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Zhou J; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Li L; Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Guo L; Department of Mechanical and Energy Engineering, Southern University of Science and Technology, Shenzhen 518055, China.
Chen G; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.
Wang EN; Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States.

ACS Appl Mater Interfaces ; 13(38): 46055-46064, 2021 Sep 29.

Article em En | MEDLINE | ID: mdl-34529424

Palavras-chave

2D−3D heterostructure; MoS2; phonon; thermal conductance; thermal conductivity; van der Waals

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: ACS Appl Mater Interfaces Assunto da revista: BIOTECNOLOGIA / ENGENHARIA BIOMEDICA Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Estados Unidos

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