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Integration Technology for Wafer-Level LiNbO3 Single-Crystal Thin Film on Silicon by Polyimide Adhesive Bonding and Chemical Mechanical Polishing.
Geng, Wenping; Yang, Xiangyu; Xue, Gang; Xu, Wenhao; Bi, Kaixi; Mei, Linyu; Zhang, Le; Hou, Xiaojuan; Chou, Xiujian.
Afiliação
  • Geng W; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
  • Yang X; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
  • Xue G; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
  • Xu W; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
  • Bi K; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
  • Mei L; School of Mechanical Engineering, North University of China, Taiyuan 030051, China.
  • Zhang L; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
  • Hou X; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
  • Chou X; Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan 030051, China.
Nanomaterials (Basel) ; 11(10)2021 Sep 29.
Article em En | MEDLINE | ID: mdl-34685009
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2021 Tipo de documento: Article País de afiliação: China
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Nanomaterials (Basel) Ano de publicação: 2021 Tipo de documento: Article País de afiliação: China