Design of protective and high sensitivity encapsulation layers in wearable devices.

Wang, XiuFeng; Huang, JieLong; Liu, YangChengYi; Tan, JinYuan; Chen, ShangDa; Avila, Raudel; Xie, ZhaoQian

Wang, XiuFeng; Huang, JieLong; Liu, YangChengYi; Tan, JinYuan; Chen, ShangDa; Avila, Raudel; Xie, ZhaoQian.

Afiliação

Wang X; School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China.
Huang J; School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China.
Liu Y; School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China.
Tan J; School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China.
Chen S; School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China.
Avila R; Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208 USA.
Xie Z; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024 China.

Sci China Technol Sci ; 66(1): 223-232, 2023.

Article em En | MEDLINE | ID: mdl-36593863

Palavras-chave

elastomeric encapsulation; strain-isolation effect; stress-isolation effect; transversely isotropic medium; wearable devices

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Diagnostic_studies / Prognostic_studies Idioma: En Revista: Sci China Technol Sci Ano de publicação: 2023 Tipo de documento: Article

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