Electrodeposition model with dynamic ion diffusion coefficients for predicting void defects in electroformed microcolumn arrays.

Ma, Zhigao; Jiang, Bingyan; Dong, Yanzhuo; Qiang, Jun; Drummer, Dietmar; Zhang, Lu

Ma, Zhigao; Jiang, Bingyan; Dong, Yanzhuo; Qiang, Jun; Drummer, Dietmar; Zhang, Lu.

Afiliação

Ma Z; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China. zhangl@csu.edu.cn.
Jiang B; State Key Laboratory of High Performance Complex Manufacturing, Changsha 410083, China.
Dong Y; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China. zhangl@csu.edu.cn.
Qiang J; State Key Laboratory of High Performance Complex Manufacturing, Changsha 410083, China.
Drummer D; School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China. zhangl@csu.edu.cn.
Zhang L; State Key Laboratory of High Performance Complex Manufacturing, Changsha 410083, China.

Phys Chem Chem Phys ; 25(10): 7407-7416, 2023 Mar 08.

Article em En | MEDLINE | ID: mdl-36846986

Texto completo

Imprimir

XML

PubMed Links

Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Tipo de estudo: Prognostic_studies / Risk_factors_studies Idioma: En Revista: Phys Chem Chem Phys Assunto da revista: BIOFISICA / QUIMICA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China

Texto completo

Imprimir

XML

PubMed Links

Buscar no Google