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A Sewing Approach to the Fabrication of Eco/bioresorbable Electronics.
Wu, Yunyun; Rytkin, Eric; Bimrose, Miles; Li, Shupeng; Choi, Yeon Sik; Lee, Geumbee; Wang, Yue; Tang, Lichao; Madrid, Micah; Wickerson, Grace; Chang, Jan-Kai; Gu, Jianyu; Zhang, Yamin; Liu, Jiaqi; Tawfick, Sameh; Huang, Yonggang; King, William P; Efimov, Igor R; Rogers, John A.
Afiliação
  • Wu Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Rytkin E; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Bimrose M; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.
  • Li S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Choi YS; Department of Materials Science and Engineering, Yonsei University, Seodaemun-gu, Seoul, 03722, Republic of Korea.
  • Lee G; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Wang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Tang L; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Madrid M; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Wickerson G; Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Chang JK; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Gu J; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA.
  • Zhang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Liu J; Wearifi Inc, Evanston, IL, 60208, USA.
  • Tawfick S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Huang Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • King WP; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
  • Efimov IR; Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, 61801, USA.
  • Rogers JA; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA.
Small ; 19(49): e2305017, 2023 Dec.
Article em En | MEDLINE | ID: mdl-37528504
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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Implantes Absorvíveis / Eletrônica Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos
Texto completo
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Assunto principal: Implantes Absorvíveis / Eletrônica Idioma: En Revista: Small Assunto da revista: ENGENHARIA BIOMEDICA Ano de publicação: 2023 Tipo de documento: Article País de afiliação: Estados Unidos